Part Details for TMM24256BP-20 by Toshiba America Electronic Components
Overview of TMM24256BP-20 by Toshiba America Electronic Components
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for TMM24256BP-20
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Quest Components | 32K X 8 OTPROM, 200 ns, 28 Pin Plastic DIP | 13 |
|
$6.0000 / $12.0000 | Buy Now |
Part Details for TMM24256BP-20
TMM24256BP-20 CAD Models
TMM24256BP-20 Part Data Attributes:
|
|
TMM24256BP-20
Toshiba America Electronic Components
Buy Now
Datasheet
|
Compare Parts:
TMM24256BP-20
Toshiba America Electronic Components
IC 32K X 8 OTPROM, 200 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM
|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-PDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 262144 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.2 mm | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | NMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for TMM24256BP-20
This table gives cross-reference parts and alternative options found for TMM24256BP-20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMM24256BP-20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27C256-200PI | OTP ROM, 32KX8, 200ns, CMOS, PDIP28, DIP-28 | Spansion | TMM24256BP-20 vs AM27C256-200PI |
| AS27C256A-20JM/MIL | Memory IC | Micross Components | TMM24256BP-20 vs AS27C256A-20JM/MIL |
| DM27C256-20/B | UVPROM, 32KX8, 200ns, CMOS, CDIP28 | LSI Corporation | TMM24256BP-20 vs DM27C256-20/B |
| NMC27C256BN20 | IC 32K X 8 OTPROM, 200 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM | National Semiconductor Corporation | TMM24256BP-20 vs NMC27C256BN20 |
| NM27LC256QE200 | IC 32K X 8 UVPROM, 200 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | TMM24256BP-20 vs NM27LC256QE200 |
| NMC87C257Q200 | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | TMM24256BP-20 vs NMC87C257Q200 |
| 27C256MQG/B20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | TMM24256BP-20 vs 27C256MQG/B20 |
| QP27C256L-200/XA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | e2v technologies | TMM24256BP-20 vs QP27C256L-200/XA |
| AM27C256-200PC | OTP ROM, 32KX8, 200ns, CMOS, PDIP28, DIP-28 | Spansion | TMM24256BP-20 vs AM27C256-200PC |
| 5962-8606301UA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Waferscale Integration Inc | TMM24256BP-20 vs 5962-8606301UA |