TMM24256BP-20 vs NMC27C256QE200 feature comparison

TMM24256BP-20 Toshiba America Electronic Components

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NMC27C256QE200 National Semiconductor Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, WINDOWED, CERAMIC, DIP-28
Pin Count 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.61
Access Time-Max 200 ns 200 ns
JESD-30 Code R-PDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type OTP ROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.2 mm 5.715 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code DIP28,.6
Programming Voltage 13 V
Standby Current-Max 0.0001 A
Supply Current-Max 0.02 mA

Compare TMM24256BP-20 with alternatives

Compare NMC27C256QE200 with alternatives