Part Details for DM27C256-20/B by LSI Corporation
Overview of DM27C256-20/B by LSI Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Part Details for DM27C256-20/B
DM27C256-20/B CAD Models
DM27C256-20/B Part Data Attributes
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DM27C256-20/B
LSI Corporation
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Datasheet
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DM27C256-20/B
LSI Corporation
UVPROM, 32KX8, 200ns, CMOS, CDIP28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SEEQ TECHNOLOGY INC | |
| Package Description | DIP, DIP28,.6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.5 V | |
| Qualification Status | Not Qualified | |
| Screening Level | 38535Q/M;38534H;883B | |
| Standby Current-Max | 0.00015 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for DM27C256-20/B
This table gives cross-reference parts and alternative options found for DM27C256-20/B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DM27C256-20/B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NM27C256N200 | OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 | Fairchild Semiconductor Corporation | DM27C256-20/B vs NM27C256N200 |
| CY27C256A-200WI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 | Cypress Semiconductor | DM27C256-20/B vs CY27C256A-200WI |
| DE27C256-20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28 | LSI Corporation | DM27C256-20/B vs DE27C256-20 |
| AM27C256-200PC | OTP ROM, 32KX8, 200ns, CMOS, PDIP28, DIP-28 | Spansion | DM27C256-20/B vs AM27C256-200PC |
| TMM24256BP-20 | IC 32K X 8 OTPROM, 200 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM | Toshiba America Electronic Components | DM27C256-20/B vs TMM24256BP-20 |
| CY27C256-200WI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | DM27C256-20/B vs CY27C256-200WI |
| CY27C256-200WC | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Rochester Electronics LLC | DM27C256-20/B vs CY27C256-200WC |
| 8411103YA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Rochester Electronics LLC | DM27C256-20/B vs 8411103YA |
| 27C256MQ20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | DM27C256-20/B vs 27C256MQ20 |
| QP27C256-200/XA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | e2v technologies | DM27C256-20/B vs QP27C256-200/XA |