Part Details for NMC27C256BN20 by National Semiconductor Corporation
Overview of NMC27C256BN20 by National Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Part Details for NMC27C256BN20
NMC27C256BN20 CAD Models
NMC27C256BN20 Part Data Attributes
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NMC27C256BN20
National Semiconductor Corporation
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Datasheet
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NMC27C256BN20
National Semiconductor Corporation
IC 32K X 8 OTPROM, 200 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Package Description | DIP, DIP28,.6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 200 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 35.725 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.75 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.334 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for NMC27C256BN20
This table gives cross-reference parts and alternative options found for NMC27C256BN20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC27C256BN20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NM27C256N200 | OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 | Fairchild Semiconductor Corporation | NMC27C256BN20 vs NM27C256N200 |
| CY27C256A-200WI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 | Cypress Semiconductor | NMC27C256BN20 vs CY27C256A-200WI |
| DE27C256-20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28 | LSI Corporation | NMC27C256BN20 vs DE27C256-20 |
| AM27C256-200PC | OTP ROM, 32KX8, 200ns, CMOS, PDIP28, DIP-28 | Spansion | NMC27C256BN20 vs AM27C256-200PC |
| TMM24256BP-20 | IC 32K X 8 OTPROM, 200 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM | Toshiba America Electronic Components | NMC27C256BN20 vs TMM24256BP-20 |
| CY27C256-200WI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | NMC27C256BN20 vs CY27C256-200WI |
| CY27C256-200WC | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Rochester Electronics LLC | NMC27C256BN20 vs CY27C256-200WC |
| 8411103YA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Rochester Electronics LLC | NMC27C256BN20 vs 8411103YA |
| 27C256MQ20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | NMC27C256BN20 vs 27C256MQ20 |
| QP27C256-200/XA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | e2v technologies | NMC27C256BN20 vs QP27C256-200/XA |