Part Details for NM27LC256QE200 by National Semiconductor Corporation
Overview of NM27LC256QE200 by National Semiconductor Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Price & Stock for NM27LC256QE200
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 11 |
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RFQ |
Part Details for NM27LC256QE200
NM27LC256QE200 CAD Models
NM27LC256QE200 Part Data Attributes
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NM27LC256QE200
National Semiconductor Corporation
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Datasheet
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NM27LC256QE200
National Semiconductor Corporation
IC 32K X 8 UVPROM, 200 ns, CDIP28, CERAMIC, DIP-28, Programmable ROM
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Package Description | WDIP, DIP28,.6 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T28 | |
JESD-609 Code | e0 | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 13 V | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.01 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |
Alternate Parts for NM27LC256QE200
This table gives cross-reference parts and alternative options found for NM27LC256QE200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NM27LC256QE200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
NM27C256N200 | OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 | Fairchild Semiconductor Corporation | NM27LC256QE200 vs NM27C256N200 |
CY27C256A-200WI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 | Cypress Semiconductor | NM27LC256QE200 vs CY27C256A-200WI |
DE27C256-20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28 | LSI Corporation | NM27LC256QE200 vs DE27C256-20 |
AM27C256-200PC | OTP ROM, 32KX8, 200ns, CMOS, PDIP28, DIP-28 | Spansion | NM27LC256QE200 vs AM27C256-200PC |
TMM24256BP-20 | IC 32K X 8 OTPROM, 200 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM | Toshiba America Electronic Components | NM27LC256QE200 vs TMM24256BP-20 |
CY27C256-200WI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | NM27LC256QE200 vs CY27C256-200WI |
CY27C256-200WC | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Rochester Electronics LLC | NM27LC256QE200 vs CY27C256-200WC |
8411103YA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Rochester Electronics LLC | NM27LC256QE200 vs 8411103YA |
27C256MQ20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | NM27LC256QE200 vs 27C256MQ20 |
QP27C256-200/XA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | e2v technologies | NM27LC256QE200 vs QP27C256-200/XA |