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TMM24256BP-20 vs 5962-8606301XA feature comparison

TMM24256BP-20 Toshiba America Electronic Components

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5962-8606301XA LSI Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP SEEQ TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, WDIP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.71 8542.32.00.61
Access Time-Max 200 ns 200 ns
JESD-30 Code R-PDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type OTP ROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.2 mm 5.588 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Length 37.1475 mm
Supply Current-Max 0.025 mA
Memory » OTP ROMs
Memory » EPROMs

Compare TMM24256BP-20 with alternatives

Compare 5962-8606301XA with alternatives