Datasheets
NMC87C257Q200 by:

32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28

Part Details for NMC87C257Q200 by Texas Instruments

Overview of NMC87C257Q200 by Texas Instruments

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Applications Internet of Things (IoT) Environmental Monitoring Industrial Automation Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Renewable Energy Entertainment and Gaming Robotics and Drones

Part Details for NMC87C257Q200

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NMC87C257Q200 Part Data Attributes

NMC87C257Q200 Texas Instruments
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NMC87C257Q200 Texas Instruments 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description WDIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
Additional Feature TTL/CMOS COMPATIBLE INPUT & OUTPUT LEVELS
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

Alternate Parts for NMC87C257Q200

This table gives cross-reference parts and alternative options found for NMC87C257Q200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC87C257Q200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TMS27PC256-20NE4 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments NMC87C257Q200 vs TMS27PC256-20NE4
27C256MQB/C20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Thales Group NMC87C257Q200 vs 27C256MQB/C20
DM27C256-20 UVPROM, 32KX8, 200ns, CMOS, CDIP28 LSI Corporation NMC87C257Q200 vs DM27C256-20
NMC87C257Q200 IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation NMC87C257Q200 vs NMC87C257Q200
8411103YX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Rochester Electronics LLC NMC87C257Q200 vs 8411103YX
TMX27PC256-20NL 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments NMC87C257Q200 vs TMX27PC256-20NL
DM27C256-20/B UVPROM, 32KX8, 200ns, CMOS, CDIP28 LSI Corporation NMC87C257Q200 vs DM27C256-20/B
AS27C256A-20JI/MIL Memory IC Micross Components NMC87C257Q200 vs AS27C256A-20JI/MIL
CY27C256A-200WI UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 Cypress Semiconductor NMC87C257Q200 vs CY27C256A-200WI
NM27C256N200 OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 Fairchild Semiconductor Corporation NMC87C257Q200 vs NM27C256N200
Part Number Description Manufacturer Compare
TMS27C256-2JE 262 144-Bitprogrammable Read-Only Memory 28-CDIP -40 to 85 Texas Instruments NMC87C257Q200 vs TMS27C256-2JE
TC54256AP IC 32K X 8 OTPROM, 200 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Programmable ROM Toshiba America Electronic Components NMC87C257Q200 vs TC54256AP
8411103YA UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Defense Logistics Agency NMC87C257Q200 vs 8411103YA
AT27C256R-20KM/883 UVPROM, 32KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 Atmel Corporation NMC87C257Q200 vs AT27C256R-20KM/883
5662-860631XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v NMC87C257Q200 vs 5662-860631XA
5962-8606301XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components NMC87C257Q200 vs 5962-8606301XA
WS27C256L-20DMB UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Waferscale Integration Inc NMC87C257Q200 vs WS27C256L-20DMB
TMS27PC256-2NL4 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments NMC87C257Q200 vs TMS27PC256-2NL4
27C256-20/J 32K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc NMC87C257Q200 vs 27C256-20/J
27C256-20I/J 32K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc NMC87C257Q200 vs 27C256-20I/J

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