Part Details for 27C256MQG/B20 by Thales Group
Overview of 27C256MQG/B20 by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for 27C256MQG/B20
27C256MQG/B20 CAD Models
27C256MQG/B20 Part Data Attributes
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27C256MQG/B20
Thales Group
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Datasheet
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27C256MQG/B20
Thales Group
UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
| Part Package Code | DIP | |
| Package Description | , | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | NFC 96883 Class G | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for 27C256MQG/B20
This table gives cross-reference parts and alternative options found for 27C256MQG/B20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 27C256MQG/B20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NM27C256N200 | OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 | Fairchild Semiconductor Corporation | 27C256MQG/B20 vs NM27C256N200 |
| CY27C256A-200WI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 | Cypress Semiconductor | 27C256MQG/B20 vs CY27C256A-200WI |
| DE27C256-20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28 | LSI Corporation | 27C256MQG/B20 vs DE27C256-20 |
| AM27C256-200PC | OTP ROM, 32KX8, 200ns, CMOS, PDIP28, DIP-28 | Spansion | 27C256MQG/B20 vs AM27C256-200PC |
| TMM24256BP-20 | IC 32K X 8 OTPROM, 200 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM | Toshiba America Electronic Components | 27C256MQG/B20 vs TMM24256BP-20 |
| CY27C256-200WI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | 27C256MQG/B20 vs CY27C256-200WI |
| CY27C256-200WC | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Rochester Electronics LLC | 27C256MQG/B20 vs CY27C256-200WC |
| 8411103YA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Rochester Electronics LLC | 27C256MQG/B20 vs 8411103YA |
| 27C256MQ20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | 27C256MQG/B20 vs 27C256MQ20 |
| QP27C256-200/XA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | e2v technologies | 27C256MQG/B20 vs QP27C256-200/XA |