Datasheets
NMC27C256Q200 by:

IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM

Part Details for NMC27C256Q200 by National Semiconductor Corporation

Overview of NMC27C256Q200 by National Semiconductor Corporation

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Applications Consumer Electronics

Price & Stock for NMC27C256Q200

Part # Distributor Description Stock Price Buy
Bristol Electronics   120
RFQ
Quest Components EPROM, 32K x 8, 28 Pin, Ceramic, DIP 1
  • 1 $9.0000
  • 2 $6.0000
$6.0000 / $9.0000 Buy Now
Quest Components EPROM, 32K x 8, 28 Pin, Ceramic, DIP 96
  • 1 $9.0000
  • 5 $4.5000
  • 45 $4.2000
$4.2000 / $9.0000 Buy Now
Quest Components EPROM, 32K x 8, 28 Pin, Ceramic, DIP 35
  • 1 $9.0000
  • 4 $6.6000
  • 12 $6.0000
$6.0000 / $9.0000 Buy Now
Quest Components EPROM, 32K x 8, 28 Pin, Ceramic, DIP 33
  • 1 $12.0000
  • 4 $6.0000
  • 34 $5.6000
$5.6000 / $12.0000 Buy Now
Quest Components EPROM, 32K x 8, 28 Pin, Ceramic, DIP 24
  • 1 $9.0000
  • 4 $6.6000
  • 12 $6.0000
$6.0000 / $9.0000 Buy Now
Chip 1 Exchange INSTOCK 724
RFQ

Part Details for NMC27C256Q200

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NMC27C256Q200 Part Data Attributes

NMC27C256Q200 National Semiconductor Corporation
Buy Now Datasheet
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NMC27C256Q200 National Semiconductor Corporation IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Package Description WINDOWED, CERAMIC, DIP-28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Programming Voltage 13 V
Qualification Status Not Qualified
Seated Height-Max 5.715 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.02 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for NMC27C256Q200

This table gives cross-reference parts and alternative options found for NMC27C256Q200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC27C256Q200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
NMC27C256QE200 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 Texas Instruments NMC27C256Q200 vs NMC27C256QE200
NMC27C256BQ200 IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation NMC27C256Q200 vs NMC27C256BQ200
AS27C256-20JM UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components NMC27C256Q200 vs AS27C256-20JM
AM27C256-205DC UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD NMC27C256Q200 vs AM27C256-205DC
MBM27C256A-20WZ 32KX8 UVPROM, 200ns, CDIP28, CERDIP-28 FUJITSU Limited NMC27C256Q200 vs MBM27C256A-20WZ
AM27C256-200DI UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD NMC27C256Q200 vs AM27C256-200DI
AM27C256-205DI UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD NMC27C256Q200 vs AM27C256-205DI
AM27C256-200DCB UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 Spansion NMC27C256Q200 vs AM27C256-200DCB
TMS27C256-20JL4 32KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments NMC27C256Q200 vs TMS27C256-20JL4
HN27C256G-20 32KX8 UVPROM, 200ns, CDIP28, CERDIP-28 Renesas Electronics Corporation NMC27C256Q200 vs HN27C256G-20
Part Number Description Manufacturer Compare
TMS27C256-2JE 262 144-Bitprogrammable Read-Only Memory 28-CDIP -40 to 85 Texas Instruments NMC27C256Q200 vs TMS27C256-2JE
8411103YA UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Defense Logistics Agency NMC27C256Q200 vs 8411103YA
27C256-20I/J 32K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc NMC27C256Q200 vs 27C256-20I/J
QP27256-2 OTP ROM, 32KX8, 200ns, NMOS, PDIP28, PLASTIC, DIP-28 Intel Corporation NMC27C256Q200 vs QP27256-2
5962-8606301XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation NMC27C256Q200 vs 5962-8606301XA
AM27C256-200DEB UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD NMC27C256Q200 vs AM27C256-200DEB
FT27C256R-20DI UVPROM, 32KX8, 20ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Force Technologies Ltd NMC27C256Q200 vs FT27C256R-20DI
AM27C256-200DIB UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 Spansion NMC27C256Q200 vs AM27C256-200DIB
NM27C256Q250 UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 Fairchild Semiconductor Corporation NMC27C256Q200 vs NM27C256Q250
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 VLSI Technology Inc NMC27C256Q200 vs 5962-8606301XX

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