Part Details for AM27C256-200PC by Spansion
Overview of AM27C256-200PC by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for AM27C256-200PC
AM27C256-200PC CAD Models
AM27C256-200PC Part Data Attributes
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AM27C256-200PC
Spansion
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Datasheet
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AM27C256-200PC
Spansion
OTP ROM, 32KX8, 200ns, CMOS, PDIP28, DIP-28
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | DIP | |
| Package Description | DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-PDIP-T28 | |
| Length | 37.084 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.715 mm | |
| Supply Current-Max | 0.025 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for AM27C256-200PC
This table gives cross-reference parts and alternative options found for AM27C256-200PC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C256-200PC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NM27C256N200 | OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 | Fairchild Semiconductor Corporation | AM27C256-200PC vs NM27C256N200 |
| CY27C256A-200WI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-28 | Cypress Semiconductor | AM27C256-200PC vs CY27C256A-200WI |
| DE27C256-20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28 | LSI Corporation | AM27C256-200PC vs DE27C256-20 |
| TMM24256BP-20 | IC 32K X 8 OTPROM, 200 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM | Toshiba America Electronic Components | AM27C256-200PC vs TMM24256BP-20 |
| CY27C256-200WI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | AM27C256-200PC vs CY27C256-200WI |
| CY27C256-200WC | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Rochester Electronics LLC | AM27C256-200PC vs CY27C256-200WC |
| 8411103YA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Rochester Electronics LLC | AM27C256-200PC vs 8411103YA |
| 27C256MQ20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | AM27C256-200PC vs 27C256MQ20 |
| QP27C256-200/XA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | e2v technologies | AM27C256-200PC vs QP27C256-200/XA |
| TMS27PC256-2NL4 | 32KX8 OTPROM, 200ns, PDIP28 | Texas Instruments | AM27C256-200PC vs TMS27PC256-2NL4 |