Part Details for PC745BMZFU300LD by Atmel Corporation
Overview of PC745BMZFU300LD by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for PC745BMZFU300LD
PC745BMZFU300LD CAD Models
PC745BMZFU300LD Part Data Attributes:
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PC745BMZFU300LD
Atmel Corporation
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Datasheet
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PC745BMZFU300LD
Atmel Corporation
RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | ATMEL CORP | |
Part Package Code | BGA | |
Package Description | BGA, BGA255,16X16,50 | |
Pin Count | 255 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 100 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B255 | |
JESD-609 Code | e0 | |
Length | 21 mm | |
Low Power Mode | YES | |
Number of Terminals | 255 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA255,16X16,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.8 mm | |
Speed | 300 MHz | |
Supply Voltage-Max | 2.1 V | |
Supply Voltage-Min | 1.9 V | |
Supply Voltage-Nom | 2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 21 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PC745BMZFU300LD
This table gives cross-reference parts and alternative options found for PC745BMZFU300LD. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC745BMZFU300LD, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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PC745VGHU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 | Atmel Corporation | PC745BMZFU300LD vs PC745VGHU300LE |
XPC745BRX300LE | 32-BIT, 300MHz, RISC PROCESSOR, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255 | Freescale Semiconductor | PC745BMZFU300LD vs XPC745BRX300LE |
PCX745BMZFU300LD | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 | Thales Group | PC745BMZFU300LD vs PCX745BMZFU300LD |
MPC745BVT300 | 32-BIT, 300MHz, RISC PROCESSOR, PBGA255 | NXP Semiconductors | PC745BMZFU300LD vs MPC745BVT300 |
PC745VZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 | e2v technologies | PC745BMZFU300LD vs PC745VZFU300LE |
PC745BVZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 | Thales Group | PC745BMZFU300LD vs PC745BVZFU300LE |
PCX745MZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 | e2v technologies | PC745BMZFU300LD vs PCX745MZFU300LE |
PC745VZF300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-255 | Atmel Corporation | PC745BMZFU300LD vs PC745VZF300LE |
MPC745BPX300 | 32-BIT, 300MHz, RISC PROCESSOR, PBGA255 | NXP Semiconductors | PC745BMZFU300LD vs MPC745BPX300 |
PC745VGH300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 | e2v technologies | PC745BMZFU300LD vs PC745VGH300LE |