Datasheets
PC745BMZFU300LD by:

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255

Part Details for PC745BMZFU300LD by Atmel Corporation

Overview of PC745BMZFU300LD by Atmel Corporation

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Part Details for PC745BMZFU300LD

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PC745BMZFU300LD Part Data Attributes:

PC745BMZFU300LD Atmel Corporation
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PC745BMZFU300LD Atmel Corporation RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer ATMEL CORP
Part Package Code BGA
Package Description BGA, BGA255,16X16,50
Pin Count 255
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B255
JESD-609 Code e0
Length 21 mm
Low Power Mode YES
Number of Terminals 255
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA255,16X16,50
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.8 mm
Speed 300 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.9 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC745BMZFU300LD

This table gives cross-reference parts and alternative options found for PC745BMZFU300LD. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC745BMZFU300LD, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PC745VGHU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 Atmel Corporation PC745BMZFU300LD vs PC745VGHU300LE
XPC745BRX300LE 32-BIT, 300MHz, RISC PROCESSOR, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255 Freescale Semiconductor PC745BMZFU300LD vs XPC745BRX300LE
PCX745BMZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 Thales Group PC745BMZFU300LD vs PCX745BMZFU300LD
MPC745BVT300 32-BIT, 300MHz, RISC PROCESSOR, PBGA255 NXP Semiconductors PC745BMZFU300LD vs MPC745BVT300
PC745VZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 e2v technologies PC745BMZFU300LD vs PC745VZFU300LE
PC745BVZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 Thales Group PC745BMZFU300LD vs PC745BVZFU300LE
PCX745MZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 e2v technologies PC745BMZFU300LD vs PCX745MZFU300LE
PC745VZF300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-255 Atmel Corporation PC745BMZFU300LD vs PC745VZF300LE
MPC745BPX300 32-BIT, 300MHz, RISC PROCESSOR, PBGA255 NXP Semiconductors PC745BMZFU300LD vs MPC745BPX300
PC745VGH300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 e2v technologies PC745BMZFU300LD vs PC745VGH300LE
Part Number Description Manufacturer Compare
TS(X)PC603EMGU3LN 32-BIT, 100MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 e2v technologies PC745BMZFU300LD vs TS(X)PC603EMGU3LN
IBM25EMPPC740LFBB3330 RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 IBM PC745BMZFU300LD vs IBM25EMPPC740LFBB3330
TSXPC740AVG10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies PC745BMZFU300LD vs TSXPC740AVG10LE
TSXPC603EVGU/T2LL RISC Microprocessor, 32-Bit, 80MHz, CMOS, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation PC745BMZFU300LD vs TSXPC603EVGU/T2LL
TSXPC740AVGS12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 Atmel Corporation PC745BMZFU300LD vs TSXPC740AVGS12LE
TSPC740AVGU/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation PC745BMZFU300LD vs TSPC740AVGU/T10LH
WED3C755E8M-350BC RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 White Electronic Designs Corp PC745BMZFU300LD vs WED3C755E8M-350BC
PPC604EBX166X RISC Microprocessor, 32-Bit, 166.67MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 IBM PC745BMZFU300LD vs PPC604EBX166X
TS(X)PC603RMGSB/Q6L(C) RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255 Thales Group PC745BMZFU300LD vs TS(X)PC603RMGSB/Q6L(C)
TSXPC603RVG12LC RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 e2v technologies PC745BMZFU300LD vs TSXPC603RVG12LC

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