Datasheets
XPC745BRX300LE by:

32-BIT, 300MHz, RISC PROCESSOR, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255

Part Details for XPC745BRX300LE by Freescale Semiconductor

Overview of XPC745BRX300LE by Freescale Semiconductor

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Part Details for XPC745BRX300LE

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XPC745BRX300LE Part Data Attributes

XPC745BRX300LE Freescale Semiconductor
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XPC745BRX300LE Freescale Semiconductor 32-BIT, 300MHz, RISC PROCESSOR, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255
Part Life Cycle Code Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC
Part Package Code BGA
Package Description 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255
Pin Count 255
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B255
Length 21 mm
Low Power Mode YES
Number of Terminals 255
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA255,16X16,50
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.8 mm
Speed 300 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.8 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for XPC745BRX300LE

This table gives cross-reference parts and alternative options found for XPC745BRX300LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC745BRX300LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
XPC745BPX300LE 32-BIT, 300MHz, RISC PROCESSOR, PBGA255, 21 X 21 MM, PLASTIC, BGA-255 Motorola Mobility LLC XPC745BRX300LE vs XPC745BPX300LE
PC745VZF300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 e2v technologies XPC745BRX300LE vs PC745VZF300LE
PC745MGHU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 e2v technologies XPC745BRX300LE vs PC745MGHU300LE
PC745BMZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 Thales Group XPC745BRX300LE vs PC745BMZFU300LD
PC745BVZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 Thales Group XPC745BRX300LE vs PC745BVZFU300LE
PC745BMZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 Atmel Corporation XPC745BRX300LE vs PC745BMZFU300LD
PC745CMZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP-CHIP, PLASTIC, BGA-360 Atmel Corporation XPC745BRX300LE vs PC745CMZFU300LE
PCX745VZF300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 e2v technologies XPC745BRX300LE vs PCX745VZF300LE
PCX745BVZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 Thales Group XPC745BRX300LE vs PCX745BVZFU300LD
PC745VZF300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-255 Atmel Corporation XPC745BRX300LE vs PC745VZF300LE
Part Number Description Manufacturer Compare
WEDMC64603RV200CM RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, CGA-255 Microsemi Corporation XPC745BRX300LE vs WEDMC64603RV200CM
TS(X)PC603RVGU/T6L(C) RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255 Thales Group XPC745BRX300LE vs TS(X)PC603RVGU/T6L(C)
MPC603RRX266LC 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 Freescale Semiconductor XPC745BRX300LE vs MPC603RRX266LC
PCX740PVGU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation XPC745BRX300LE vs PCX740PVGU300LE
TS(X)PC603PVGU/T6LE 32-BIT, 166 MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 e2v technologies XPC745BRX300LE vs TS(X)PC603PVGU/T6LE
TSPC740AMGSB/T12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 Atmel Corporation XPC745BRX300LE vs TSPC740AMGSB/T12LE
TSPC740AVGB/T10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation XPC745BRX300LE vs TSPC740AVGB/T10LE
TS(X)PC603EMGU3LL RISC Microprocessor, 32-Bit, 100MHz, CMOS, CBGA255, CERAMIC, BGA-255 Thales Group XPC745BRX300LE vs TS(X)PC603EMGU3LL
TSPC740AMGSU/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 Atmel Corporation XPC745BRX300LE vs TSPC740AMGSU/T10LH
TS(X)PC603EVGB/C4MN RISC Microprocessor, 32-Bit, 120MHz, CMOS, CBGA255, CERAMIC, BGA-255 Thales Group XPC745BRX300LE vs TS(X)PC603EVGB/C4MN

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