Part Details for TSXPC603RVG12LC by e2v technologies
Overview of TSXPC603RVG12LC by e2v technologies
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSXPC603RVG12LC
TSXPC603RVG12LC CAD Models
TSXPC603RVG12LC Part Data Attributes:
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TSXPC603RVG12LC
e2v technologies
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Datasheet
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TSXPC603RVG12LC
e2v technologies
RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 255 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 75 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B255 | |
JESD-609 Code | e0 | |
Length | 21 mm | |
Low Power Mode | YES | |
Number of Terminals | 255 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3 mm | |
Speed | 266 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 21 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSXPC603RVG12LC
This table gives cross-reference parts and alternative options found for TSXPC603RVG12LC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXPC603RVG12LC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TSPC603RMGH12LC | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCEBGA-255 | e2v technologies | TSXPC603RVG12LC vs TSPC603RMGH12LC |
TSXPC603RVGB/Q12LC | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | e2v technologies | TSXPC603RVG12LC vs TSXPC603RVGB/Q12LC |
MPC603RRX266LX | 32-BIT, 266MHz, RISC PROCESSOR, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | Motorola Mobility LLC | TSXPC603RVG12LC vs MPC603RRX266LX |
MPC603RRX266LX | 32-BIT, 266MHz, RISC PROCESSOR, CBGA255 | NXP Semiconductors | TSXPC603RVG12LC vs MPC603RRX266LX |
TSXPC603RMG12LC | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | e2v technologies | TSXPC603RVG12LC vs TSXPC603RMG12LC |
MPC603RRX266LX | 32-BIT, 266MHz, RISC PROCESSOR, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Freescale Semiconductor | TSXPC603RVG12LC vs MPC603RRX266LX |
TSPC603RVGH12LC | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCEBGA-255 | e2v technologies | TSXPC603RVG12LC vs TSPC603RVGH12LC |
XPC603PRX266TX | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | Motorola Semiconductor Products | TSXPC603RVG12LC vs XPC603PRX266TX |
TSPC603RVGU12LC | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | e2v technologies | TSXPC603RVG12LC vs TSPC603RVGU12LC |
TSXPC603RVGU12LC | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | e2v technologies | TSXPC603RVG12LC vs TSXPC603RVGU12LC |