PC745BMZFU300LD vs PC745BVZFU300LE feature comparison

PC745BMZFU300LD Atmel Corporation

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PC745BVZFU300LE Thales Group

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ATMEL CORP THOMSON-CSF SEMICONDUCTORS
Part Package Code BGA BGA
Package Description BGA, BGA255,16X16,50 ,
Pin Count 255 255
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 100 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B255 S-PBGA-B255
JESD-609 Code e0
Length 21 mm
Low Power Mode YES YES
Number of Terminals 255 255
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA255,16X16,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm
Speed 300 MHz 300 MHz
Supply Voltage-Max 2.1 V 2.1 V
Supply Voltage-Min 1.9 V 1.9 V
Supply Voltage-Nom 2 V 2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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Compare PC745BVZFU300LE with alternatives