PC745BMZFU300LD
vs
PC745BVZFU300LE
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ATMEL CORP
THOMSON-CSF SEMICONDUCTORS
Part Package Code
BGA
BGA
Package Description
BGA, BGA255,16X16,50
,
Pin Count
255
255
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
100 MHz
100 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B255
S-PBGA-B255
JESD-609 Code
e0
Length
21 mm
Low Power Mode
YES
YES
Number of Terminals
255
255
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA255,16X16,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.8 mm
Speed
300 MHz
300 MHz
Supply Voltage-Max
2.1 V
2.1 V
Supply Voltage-Min
1.9 V
1.9 V
Supply Voltage-Nom
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
21 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Compare PC745BMZFU300LD with alternatives
Compare PC745BVZFU300LE with alternatives