Datasheets
PCX745BMZFU300LD by:

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255

Part Details for PCX745BMZFU300LD by Thales Group

Overview of PCX745BMZFU300LD by Thales Group

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Part Details for PCX745BMZFU300LD

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PCX745BMZFU300LD Part Data Attributes

PCX745BMZFU300LD Thales Group
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PCX745BMZFU300LD Thales Group RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255
Part Life Cycle Code Transferred
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS
Part Package Code BGA
Package Description ,
Pin Count 255
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B255
Low Power Mode YES
Number of Terminals 255
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Speed 300 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.9 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form BALL
Terminal Position BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PCX745BMZFU300LD

This table gives cross-reference parts and alternative options found for PCX745BMZFU300LD. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PCX745BMZFU300LD, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
XPC745BPX300LE 32-BIT, 300MHz, RISC PROCESSOR, PBGA255, 21 X 21 MM, PLASTIC, BGA-255 Motorola Mobility LLC PCX745BMZFU300LD vs XPC745BPX300LE
PC745VZF300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 e2v technologies PCX745BMZFU300LD vs PC745VZF300LE
PC745MGHU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 e2v technologies PCX745BMZFU300LD vs PC745MGHU300LE
PC745BMZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 Thales Group PCX745BMZFU300LD vs PC745BMZFU300LD
PC745BVZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 Thales Group PCX745BMZFU300LD vs PC745BVZFU300LE
PC745BMZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 Atmel Corporation PCX745BMZFU300LD vs PC745BMZFU300LD
PC745CMZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP-CHIP, PLASTIC, BGA-360 Atmel Corporation PCX745BMZFU300LD vs PC745CMZFU300LE
PCX745VZF300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 e2v technologies PCX745BMZFU300LD vs PCX745VZF300LE
PCX745BVZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 Thales Group PCX745BMZFU300LD vs PCX745BVZFU300LD
PC745VZF300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-255 Atmel Corporation PCX745BMZFU300LD vs PC745VZF300LE
Part Number Description Manufacturer Compare
WEDMC64603RV200CM RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, CGA-255 Microsemi Corporation PCX745BMZFU300LD vs WEDMC64603RV200CM
TS(X)PC603RVGU/T6L(C) RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255 Thales Group PCX745BMZFU300LD vs TS(X)PC603RVGU/T6L(C)
MPC603RRX266LC 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 Freescale Semiconductor PCX745BMZFU300LD vs MPC603RRX266LC
PCX740PVGU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation PCX745BMZFU300LD vs PCX740PVGU300LE
TS(X)PC603PVGU/T6LE 32-BIT, 166 MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 e2v technologies PCX745BMZFU300LD vs TS(X)PC603PVGU/T6LE
TSPC740AMGSB/T12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 Atmel Corporation PCX745BMZFU300LD vs TSPC740AMGSB/T12LE
TSPC740AVGB/T10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation PCX745BMZFU300LD vs TSPC740AVGB/T10LE
TS(X)PC603EMGU3LL RISC Microprocessor, 32-Bit, 100MHz, CMOS, CBGA255, CERAMIC, BGA-255 Thales Group PCX745BMZFU300LD vs TS(X)PC603EMGU3LL
TSPC740AMGSU/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 Atmel Corporation PCX745BMZFU300LD vs TSPC740AMGSU/T10LH
TS(X)PC603EVGB/C4MN RISC Microprocessor, 32-Bit, 120MHz, CMOS, CBGA255, CERAMIC, BGA-255 Thales Group PCX745BMZFU300LD vs TS(X)PC603EVGB/C4MN

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