Part Details for PC745VGH300LE by e2v technologies
Overview of PC745VGH300LE by e2v technologies
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for PC745VGH300LE
PC745VGH300LE CAD Models
PC745VGH300LE Part Data Attributes
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PC745VGH300LE
e2v technologies
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Datasheet
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PC745VGH300LE
e2v technologies
RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | E2V TECHNOLOGIES PLC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 255 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B255 | |
| Length | 21 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 255 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.08 mm | |
| Speed | 300 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PC745VGH300LE
This table gives cross-reference parts and alternative options found for PC745VGH300LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC745VGH300LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XPC745BPX300LE | 32-BIT, 300MHz, RISC PROCESSOR, PBGA255, 21 X 21 MM, PLASTIC, BGA-255 | Motorola Mobility LLC | PC745VGH300LE vs XPC745BPX300LE |
| PC745VZF300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 | e2v technologies | PC745VGH300LE vs PC745VZF300LE |
| PC745MGHU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 | e2v technologies | PC745VGH300LE vs PC745MGHU300LE |
| PC745BMZFU300LD | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 | Thales Group | PC745VGH300LE vs PC745BMZFU300LD |
| PC745BVZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 | Thales Group | PC745VGH300LE vs PC745BVZFU300LE |
| PC745BMZFU300LD | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 | Atmel Corporation | PC745VGH300LE vs PC745BMZFU300LD |
| PC745CMZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP-CHIP, PLASTIC, BGA-360 | Atmel Corporation | PC745VGH300LE vs PC745CMZFU300LE |
| PCX745VZF300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 | e2v technologies | PC745VGH300LE vs PCX745VZF300LE |
| PCX745BVZFU300LD | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 | Thales Group | PC745VGH300LE vs PCX745BVZFU300LD |
| PC745VZF300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-255 | Atmel Corporation | PC745VGH300LE vs PC745VZF300LE |