Datasheets
MPC745BPX300 by:

32-BIT, 300MHz, RISC PROCESSOR, PBGA255

Part Details for MPC745BPX300 by NXP Semiconductors

Overview of MPC745BPX300 by NXP Semiconductors

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Part Details for MPC745BPX300

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MPC745BPX300 Part Data Attributes

MPC745BPX300 NXP Semiconductors
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MPC745BPX300 NXP Semiconductors 32-BIT, 300MHz, RISC PROCESSOR, PBGA255
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description BGA,
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B255
Length 21 mm
Low Power Mode YES
Number of Terminals 255
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.8 mm
Speed 300 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.8 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for MPC745BPX300

This table gives cross-reference parts and alternative options found for MPC745BPX300. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC745BPX300, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
XPC745BPX300LE 32-BIT, 300MHz, RISC PROCESSOR, PBGA255, 21 X 21 MM, PLASTIC, BGA-255 Motorola Mobility LLC MPC745BPX300 vs XPC745BPX300LE
PC745VZF300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 e2v technologies MPC745BPX300 vs PC745VZF300LE
PC745MGHU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 e2v technologies MPC745BPX300 vs PC745MGHU300LE
PC745BMZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 Thales Group MPC745BPX300 vs PC745BMZFU300LD
PC745BVZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 Thales Group MPC745BPX300 vs PC745BVZFU300LE
PC745BMZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 Atmel Corporation MPC745BPX300 vs PC745BMZFU300LD
PC745CMZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP-CHIP, PLASTIC, BGA-360 Atmel Corporation MPC745BPX300 vs PC745CMZFU300LE
PCX745VZF300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-255 e2v technologies MPC745BPX300 vs PCX745VZF300LE
PCX745BVZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, FLIP CHIP, PLASTIC, BGA-255 Thales Group MPC745BPX300 vs PCX745BVZFU300LD
PC745VZF300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-255 Atmel Corporation MPC745BPX300 vs PC745VZF300LE
Part Number Description Manufacturer Compare
WEDMC64603RV200CM RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, CGA-255 Microsemi Corporation MPC745BPX300 vs WEDMC64603RV200CM
TS(X)PC603RVGU/T6L(C) RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255 Thales Group MPC745BPX300 vs TS(X)PC603RVGU/T6L(C)
MPC603RRX266LC 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 Freescale Semiconductor MPC745BPX300 vs MPC603RRX266LC
PCX740PVGU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation MPC745BPX300 vs PCX740PVGU300LE
TS(X)PC603PVGU/T6LE 32-BIT, 166 MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 e2v technologies MPC745BPX300 vs TS(X)PC603PVGU/T6LE
TSPC740AMGSB/T12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 Atmel Corporation MPC745BPX300 vs TSPC740AMGSB/T12LE
TSPC740AVGB/T10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation MPC745BPX300 vs TSPC740AVGB/T10LE
TS(X)PC603EMGU3LL RISC Microprocessor, 32-Bit, 100MHz, CMOS, CBGA255, CERAMIC, BGA-255 Thales Group MPC745BPX300 vs TS(X)PC603EMGU3LL
TSPC740AMGSU/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 Atmel Corporation MPC745BPX300 vs TSPC740AMGSU/T10LH
TS(X)PC603EVGB/C4MN RISC Microprocessor, 32-Bit, 120MHz, CMOS, CBGA255, CERAMIC, BGA-255 Thales Group MPC745BPX300 vs TS(X)PC603EVGB/C4MN

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