Part Details for PC755BMZFU300LE by Atmel Corporation
Overview of PC755BMZFU300LE by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for PC755BMZFU300LE
PC755BMZFU300LE CAD Models
PC755BMZFU300LE Part Data Attributes:
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PC755BMZFU300LE
Atmel Corporation
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Datasheet
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PC755BMZFU300LE
Atmel Corporation
RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | ATMEL CORP | |
Part Package Code | BGA | |
Package Description | BGA, BGA360,19X19,50 | |
Pin Count | 360 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 100 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B360 | |
JESD-609 Code | e0 | |
Length | 25 mm | |
Low Power Mode | YES | |
Number of Terminals | 360 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA360,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.77 mm | |
Speed | 300 MHz | |
Supply Voltage-Max | 2.1 V | |
Supply Voltage-Min | 1.8 V | |
Supply Voltage-Nom | 2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PC755BMZFU300LE
This table gives cross-reference parts and alternative options found for PC755BMZFU300LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BMZFU300LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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IBM25PPC750L-FB0A300W | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | PC755BMZFU300LE vs IBM25PPC750L-FB0A300W |
PC755BMZFU300LD | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 | e2v technologies | PC755BMZFU300LE vs PC755BMZFU300LD |
PCX755MG300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CERAMIC, BGA-360 | e2v technologies | PC755BMZFU300LE vs PCX755MG300LE |
MPC755BVT300LE | 32-BIT, 300MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-360 | Freescale Semiconductor | PC755BMZFU300LE vs MPC755BVT300LE |
IBM25PPC750L-EB0B300W | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | PC755BMZFU300LE vs IBM25PPC750L-EB0B300W |
XPC755BPX300LD | 32-BIT, 300MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 | Motorola Mobility LLC | PC755BMZFU300LE vs XPC755BPX300LD |
PC755CVGSU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, BGA-360 | e2v technologies | PC755BMZFU300LE vs PC755CVGSU300LE |
PCX755BVZFU300LD | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 | Atmel Corporation | PC755BMZFU300LE vs PCX755BVZFU300LD |
PC755VZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 | e2v technologies | PC755BMZFU300LE vs PC755VZFU300LE |
PCX755BMZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 | Thales Group | PC755BMZFU300LE vs PCX755BMZFU300LE |