Part Details for XPC755BPX300LD by Motorola Mobility LLC
Overview of XPC755BPX300LD by Motorola Mobility LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Healthcare
Part Details for XPC755BPX300LD
XPC755BPX300LD CAD Models
XPC755BPX300LD Part Data Attributes
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XPC755BPX300LD
Motorola Mobility LLC
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Datasheet
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XPC755BPX300LD
Motorola Mobility LLC
32-BIT, 300MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MOTOROLA INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B360 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.77 mm | |
| Speed | 300 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.9 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for XPC755BPX300LD
This table gives cross-reference parts and alternative options found for XPC755BPX300LD. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC755BPX300LD, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XPC755BPX300LE | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,PLASTIC | Freescale Semiconductor | XPC755BPX300LD vs XPC755BPX300LE |
| MPC755BVT300LE | 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 | NXP Semiconductors | XPC755BPX300LD vs MPC755BVT300LE |
| PC755BVZFU300LD | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 | Thales Group | XPC755BPX300LD vs PC755BVZFU300LD |
| MPC755BRX300 | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Freescale Semiconductor | XPC755BPX300LD vs MPC755BRX300 |
| IBM25PPC750L-DB0B300W | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | XPC755BPX300LD vs IBM25PPC750L-DB0B300W |
| PCX755BMZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 | Atmel Corporation | XPC755BPX300LD vs PCX755BMZFU300LE |
| MPC755BVT300 | 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 | NXP Semiconductors | XPC755BPX300LD vs MPC755BVT300 |
| PCX755BMZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 | Thales Group | XPC755BPX300LD vs PCX755BMZFU300LE |
| PC755VZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 | e2v technologies | XPC755BPX300LD vs PC755VZFU300LE |
| MPC755BRX300LE | 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, CERAMIC, BGA-360 | Motorola Mobility LLC | XPC755BPX300LD vs MPC755BRX300LE |