Part Details for PCX755MG300LE by e2v technologies
Overview of PCX755MG300LE by e2v technologies
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for PCX755MG300LE
PCX755MG300LE CAD Models
PCX755MG300LE Part Data Attributes
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PCX755MG300LE
e2v technologies
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Datasheet
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PCX755MG300LE
e2v technologies
RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CERAMIC, BGA-360
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Part Life Cycle Code | Active | |
Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 360 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Additional Feature | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 100 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B360 | |
Length | 25 mm | |
Low Power Mode | YES | |
Number of Terminals | 360 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.2 mm | |
Speed | 300 MHz | |
Supply Voltage-Max | 2.1 V | |
Supply Voltage-Min | 1.8 V | |
Supply Voltage-Nom | 2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PCX755MG300LE
This table gives cross-reference parts and alternative options found for PCX755MG300LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PCX755MG300LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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XPC755BPX300LE | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,PLASTIC | Freescale Semiconductor | PCX755MG300LE vs XPC755BPX300LE |
MPC755BVT300LE | 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 | NXP Semiconductors | PCX755MG300LE vs MPC755BVT300LE |
PC755BVZFU300LD | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 | Thales Group | PCX755MG300LE vs PC755BVZFU300LD |
MPC755BRX300 | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Freescale Semiconductor | PCX755MG300LE vs MPC755BRX300 |
IBM25PPC750L-DB0B300W | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | PCX755MG300LE vs IBM25PPC750L-DB0B300W |
PCX755BMZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 | Atmel Corporation | PCX755MG300LE vs PCX755BMZFU300LE |
MPC755BVT300 | 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 | NXP Semiconductors | PCX755MG300LE vs MPC755BVT300 |
PCX755BMZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 | Thales Group | PCX755MG300LE vs PCX755BMZFU300LE |
PC755VZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 | e2v technologies | PCX755MG300LE vs PC755VZFU300LE |
MPC755BRX300LE | 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, CERAMIC, BGA-360 | Motorola Mobility LLC | PCX755MG300LE vs MPC755BRX300LE |