Part Details for PCX755BMZFU300LE by Thales Group
Overview of PCX755BMZFU300LE by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for PCX755BMZFU300LE
PCX755BMZFU300LE CAD Models
PCX755BMZFU300LE Part Data Attributes
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PCX755BMZFU300LE
Thales Group
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Datasheet
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PCX755BMZFU300LE
Thales Group
RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | , | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B360 | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Speed | 300 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.9 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PCX755BMZFU300LE
This table gives cross-reference parts and alternative options found for PCX755BMZFU300LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PCX755BMZFU300LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XPC755BPX300LE | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,PLASTIC | Freescale Semiconductor | PCX755BMZFU300LE vs XPC755BPX300LE |
| MPC755BVT300LE | 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 | NXP Semiconductors | PCX755BMZFU300LE vs MPC755BVT300LE |
| PC755BVZFU300LD | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 | Thales Group | PCX755BMZFU300LE vs PC755BVZFU300LD |
| MPC755BRX300 | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Freescale Semiconductor | PCX755BMZFU300LE vs MPC755BRX300 |
| IBM25PPC750L-DB0B300W | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | PCX755BMZFU300LE vs IBM25PPC750L-DB0B300W |
| PCX755BMZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 | Atmel Corporation | PCX755BMZFU300LE vs PCX755BMZFU300LE |
| MPC755BVT300 | 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 | NXP Semiconductors | PCX755BMZFU300LE vs MPC755BVT300 |
| PC755VZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 | e2v technologies | PCX755BMZFU300LE vs PC755VZFU300LE |
| MPC755BRX300LE | 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, CERAMIC, BGA-360 | Motorola Mobility LLC | PCX755BMZFU300LE vs MPC755BRX300LE |
| IBM25PPC750L-DB0A300W | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | PCX755BMZFU300LE vs IBM25PPC750L-DB0A300W |