Datasheets
FWPXA270C0E416 by:

Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-360

Part Details for FWPXA270C0E416 by Marvell Technology Group Ltd

Overview of FWPXA270C0E416 by Marvell Technology Group Ltd

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Applications Consumer Electronics Space Technology Aerospace and Defense Transportation and Logistics Communication and Networking Automotive

Part Details for FWPXA270C0E416

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FWPXA270C0E416 Part Data Attributes:

FWPXA270C0E416 Marvell Technology Group Ltd
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FWPXA270C0E416 Marvell Technology Group Ltd Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-360
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MARVELL SEMICONDUCTOR INC
Part Package Code BGA
Package Description 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-360
Pin Count 360
Reach Compliance Code unknown
HTS Code 8542.31.00.01
Address Bus Width 26
Boundary Scan YES
Clock Frequency-Max 13.002 MHz
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B360
JESD-609 Code e0
Length 23 mm
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.59 mm
Speed 416 MHz
Supply Voltage-Max 1.705 V
Supply Voltage-Min 1.2825 V
Supply Voltage-Nom 1.35 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR

Alternate Parts for FWPXA270C0E416

This table gives cross-reference parts and alternative options found for FWPXA270C0E416. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of FWPXA270C0E416, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TSXPC750AMGSB/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation FWPXA270C0E416 vs TSXPC750AMGSB/T10LH
PPC7448VS1250ND 32-BIT, 1250MHz, RISC PROCESSOR, CLGA360 NXP Semiconductors FWPXA270C0E416 vs PPC7448VS1250ND
MPC7410THX500LE 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 Freescale Semiconductor FWPXA270C0E416 vs MPC7410THX500LE
TSXC750AVGSU12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 Thales Group FWPXA270C0E416 vs TSXC750AVGSU12LH
PC755VG350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation FWPXA270C0E416 vs PC755VG350LE
PC7448VLH1250ND RISC Microprocessor, 32-Bit, 1250MHz, CMOS, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, LGA-360 e2v technologies FWPXA270C0E416 vs PC7448VLH1250ND
MPC755CVT350 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-360 Freescale Semiconductor FWPXA270C0E416 vs MPC755CVT350
PC7410VGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation FWPXA270C0E416 vs PC7410VGSU400LE
TSXPC750AVGSU12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation FWPXA270C0E416 vs TSXPC750AVGSU12LH
PC7448VGHY1250NC RISC Microprocessor, 1250MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERMIC, HITCE, BGA-360 e2v technologies FWPXA270C0E416 vs PC7448VGHY1250NC

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