Part Details for MPC755BVT300LE by Freescale Semiconductor
Overview of MPC755BVT300LE by Freescale Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
Price & Stock for MPC755BVT300LE
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | RISC Microcontroller, 32-Bit, Power Architecture , 350MHz, CMOS RoHS: Compliant Status: End of Life / Last Time Buy Min Qty: 1 | 320 |
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$87.8600 / $103.3600 | Buy Now |
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Chip 1 Exchange | INSTOCK | 130 |
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RFQ |
Part Details for MPC755BVT300LE
MPC755BVT300LE CAD Models
MPC755BVT300LE Part Data Attributes
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MPC755BVT300LE
Freescale Semiconductor
Buy Now
Datasheet
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Compare Parts:
MPC755BVT300LE
Freescale Semiconductor
32-BIT, 300MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-360
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-360 | |
| Pin Count | 360 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Additional Feature | ALSO REQUIRES 2.5V OR 3.3V SUPPLY | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B360 | |
| JESD-609 Code | e2 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 360 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA255,16X16,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.77 mm | |
| Speed | 300 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MPC755BVT300LE
This table gives cross-reference parts and alternative options found for MPC755BVT300LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC755BVT300LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XPC755BPX300LE | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,PLASTIC | Freescale Semiconductor | MPC755BVT300LE vs XPC755BPX300LE |
| MPC755BVT300LE | 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 | NXP Semiconductors | MPC755BVT300LE vs MPC755BVT300LE |
| PC755BVZFU300LD | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 | Thales Group | MPC755BVT300LE vs PC755BVZFU300LD |
| MPC755BRX300 | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Freescale Semiconductor | MPC755BVT300LE vs MPC755BRX300 |
| IBM25PPC750L-DB0B300W | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | MPC755BVT300LE vs IBM25PPC750L-DB0B300W |
| PCX755BMZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 | Atmel Corporation | MPC755BVT300LE vs PCX755BMZFU300LE |
| MPC755BVT300 | 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 | NXP Semiconductors | MPC755BVT300LE vs MPC755BVT300 |
| PCX755BMZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 | Thales Group | MPC755BVT300LE vs PCX755BMZFU300LE |
| PC755VZFU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 | e2v technologies | MPC755BVT300LE vs PC755VZFU300LE |
| MPC755BRX300LE | 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, CERAMIC, BGA-360 | Motorola Mobility LLC | MPC755BVT300LE vs MPC755BRX300LE |