Datasheets
TSXPC750AMGSU/T10LH by: Atmel Corporation

RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360

Part Details for TSXPC750AMGSU/T10LH by Atmel Corporation

Overview of TSXPC750AMGSU/T10LH by Atmel Corporation

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Applications Industrial Automation

Part Details for TSXPC750AMGSU/T10LH

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TSXPC750AMGSU/T10LH Part Data Attributes:

TSXPC750AMGSU/T10LH Atmel Corporation
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TSXPC750AMGSU/T10LH Atmel Corporation RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ATMEL CORP
Part Package Code CGA
Package Description CGA,
Pin Count 360
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 83.3 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-X360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code CGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 4.2 mm
Speed 233 MHz
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.5 V
Supply Voltage-Nom 2.6 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form UNSPECIFIED
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for TSXPC750AMGSU/T10LH

This table gives cross-reference parts and alternative options found for TSXPC750AMGSU/T10LH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXPC750AMGSU/T10LH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TSPC750AMGS10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 Thales Group TSXPC750AMGSU/T10LH vs TSPC750AMGS10LE
TSPC750AMGSB/Q10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSU/T10LH vs TSPC750AMGSB/Q10LH
TSXPC750AMGSU/T10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 e2v technologies TSXPC750AMGSU/T10LH vs TSXPC750AMGSU/T10LE
TSXPC750AVGSU10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSU/T10LH vs TSXPC750AVGSU10LH
TSPC750AVGS10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 Thales Group TSXPC750AMGSU/T10LH vs TSPC750AVGS10LH
TSPC750AVGS10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSU/T10LH vs TSPC750AVGS10LE
TSPC750AVGSU10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 Thales Group TSXPC750AMGSU/T10LH vs TSPC750AVGSU10LE
TSPC750AMGSB/T10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSU/T10LH vs TSPC750AMGSB/T10LE
TSXPC750AMGSB/T10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 e2v technologies TSXPC750AMGSU/T10LH vs TSXPC750AMGSB/T10LE
TSPC750AVGSB/Q10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSU/T10LH vs TSPC750AVGSB/Q10LH
Part Number Description Manufacturer Compare
TSXPC750AMGSB/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSU/T10LH vs TSXPC750AMGSB/T10LH
PPC7448VS1250ND 32-BIT, 1250MHz, RISC PROCESSOR, CLGA360 NXP Semiconductors TSXPC750AMGSU/T10LH vs PPC7448VS1250ND
MPC7410THX500LE 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 Freescale Semiconductor TSXPC750AMGSU/T10LH vs MPC7410THX500LE
TSXC750AVGSU12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 Thales Group TSXPC750AMGSU/T10LH vs TSXC750AVGSU12LH
PC755VG350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation TSXPC750AMGSU/T10LH vs PC755VG350LE
PC7448VLH1250ND RISC Microprocessor, 32-Bit, 1250MHz, CMOS, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, LGA-360 e2v technologies TSXPC750AMGSU/T10LH vs PC7448VLH1250ND
MPC755CVT350 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-360 Freescale Semiconductor TSXPC750AMGSU/T10LH vs MPC755CVT350
PC7410VGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation TSXPC750AMGSU/T10LH vs PC7410VGSU400LE
TSXPC750AVGSU12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSXPC750AMGSU/T10LH vs TSXPC750AVGSU12LH
PC7448VGHY1250NC RISC Microprocessor, 1250MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERMIC, HITCE, BGA-360 e2v technologies TSXPC750AMGSU/T10LH vs PC7448VGHY1250NC

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