Part Details for TSXPC750AMGSU/T10LH by Atmel Corporation
Overview of TSXPC750AMGSU/T10LH by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSXPC750AMGSU/T10LH
TSXPC750AMGSU/T10LH CAD Models
TSXPC750AMGSU/T10LH Part Data Attributes:
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TSXPC750AMGSU/T10LH
Atmel Corporation
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Datasheet
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TSXPC750AMGSU/T10LH
Atmel Corporation
RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ATMEL CORP | |
Part Package Code | CGA | |
Package Description | CGA, | |
Pin Count | 360 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 83.3 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-X360 | |
Length | 25 mm | |
Low Power Mode | YES | |
Number of Terminals | 360 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | CGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 4.2 mm | |
Speed | 233 MHz | |
Supply Voltage-Max | 2.7 V | |
Supply Voltage-Min | 2.5 V | |
Supply Voltage-Nom | 2.6 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | UNSPECIFIED | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSXPC750AMGSU/T10LH
This table gives cross-reference parts and alternative options found for TSXPC750AMGSU/T10LH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXPC750AMGSU/T10LH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TSPC750AMGS10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 | Thales Group | TSXPC750AMGSU/T10LH vs TSPC750AMGS10LE |
TSPC750AMGSB/Q10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | TSXPC750AMGSU/T10LH vs TSPC750AMGSB/Q10LH |
TSXPC750AMGSU/T10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | e2v technologies | TSXPC750AMGSU/T10LH vs TSXPC750AMGSU/T10LE |
TSXPC750AVGSU10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | TSXPC750AMGSU/T10LH vs TSXPC750AVGSU10LH |
TSPC750AVGS10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 | Thales Group | TSXPC750AMGSU/T10LH vs TSPC750AVGS10LH |
TSPC750AVGS10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | TSXPC750AMGSU/T10LH vs TSPC750AVGS10LE |
TSPC750AVGSU10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 | Thales Group | TSXPC750AMGSU/T10LH vs TSPC750AVGSU10LE |
TSPC750AMGSB/T10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | TSXPC750AMGSU/T10LH vs TSPC750AMGSB/T10LE |
TSXPC750AMGSB/T10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | e2v technologies | TSXPC750AMGSU/T10LH vs TSXPC750AMGSB/T10LE |
TSPC750AVGSB/Q10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, CGA-360 | Atmel Corporation | TSXPC750AMGSU/T10LH vs TSPC750AVGSB/Q10LH |