Part Details for TSXC750AVG12LH by Thales Group
Overview of TSXC750AVG12LH by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for TSXC750AVG12LH
TSXC750AVG12LH CAD Models
TSXC750AVG12LH Part Data Attributes:
|
|
TSXC750AVG12LH
Thales Group
Buy Now
Datasheet
|
Compare Parts:
TSXC750AVG12LH
Thales Group
RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360
|
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | , | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 83.3 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Speed | 266 MHz | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.5 V | |
| Supply Voltage-Nom | 2.6 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSXC750AVG12LH
This table gives cross-reference parts and alternative options found for TSXC750AVG12LH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXC750AVG12LH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSXPC750AMGSB/T10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | TSXC750AVG12LH vs TSXPC750AMGSB/T10LH |
| PPC7448VS1250ND | 32-BIT, 1250MHz, RISC PROCESSOR, CLGA360 | NXP Semiconductors | TSXC750AVG12LH vs PPC7448VS1250ND |
| MPC7410THX500LE | 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 | Freescale Semiconductor | TSXC750AVG12LH vs MPC7410THX500LE |
| TSXC750AVGSU12LH | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 | Thales Group | TSXC750AVG12LH vs TSXC750AVGSU12LH |
| PC755VG350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSXC750AVG12LH vs PC755VG350LE |
| PC7448VLH1250ND | RISC Microprocessor, 32-Bit, 1250MHz, CMOS, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, LGA-360 | e2v technologies | TSXC750AVG12LH vs PC7448VLH1250ND |
| MPC755CVT350 | 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-360 | Freescale Semiconductor | TSXC750AVG12LH vs MPC755CVT350 |
| PC7410VGSU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 | Atmel Corporation | TSXC750AVG12LH vs PC7410VGSU400LE |
| TSXPC750AVGSU12LH | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | TSXC750AVG12LH vs TSXPC750AVGSU12LH |
| PC7448VGHY1250NC | RISC Microprocessor, 1250MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERMIC, HITCE, BGA-360 | e2v technologies | TSXC750AVG12LH vs PC7448VGHY1250NC |