PC755BMZFU300LE
vs
IBM25PPC750L-FB0A300W
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Contact Manufacturer
|
| Ihs Manufacturer |
ATMEL CORP
|
IBM MICROELECTRONICS
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA360,19X19,50
|
BGA, BGA360,19X19,50
|
| Pin Count |
360
|
360
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
100 MHz
|
100 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B360
|
S-CBGA-B360
|
| JESD-609 Code |
e0
|
e0
|
| Length |
25 mm
|
25 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
360
|
360
|
| Operating Temperature-Max |
125 °C
|
65 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA360,19X19,50
|
BGA360,19X19,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.77 mm
|
3.2 mm
|
| Speed |
300 MHz
|
300 MHz
|
| Supply Voltage-Max |
2.1 V
|
2.1 V
|
| Supply Voltage-Min |
1.8 V
|
2 V
|
| Supply Voltage-Nom |
2 V
|
2.05 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
25 mm
|
25 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare PC755BMZFU300LE with alternatives
Compare IBM25PPC750L-FB0A300W with alternatives