Datasheets
PC755BMZFU300LD by:

RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360

Part Details for PC755BMZFU300LD by e2v technologies

Overview of PC755BMZFU300LD by e2v technologies

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Applications Education and Research Industrial Automation Telecommunications Electronic Manufacturing

Part Details for PC755BMZFU300LD

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PC755BMZFU300LD Part Data Attributes

PC755BMZFU300LD e2v technologies
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PC755BMZFU300LD e2v technologies RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360
Part Life Cycle Code Obsolete
Ihs Manufacturer E2V TECHNOLOGIES PLC
Part Package Code BGA
Package Description BGA,
Pin Count 360
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.77 mm
Speed 300 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.9 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC755BMZFU300LD

This table gives cross-reference parts and alternative options found for PC755BMZFU300LD. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BMZFU300LD, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
XPC755BPX300LE IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,PLASTIC Freescale Semiconductor PC755BMZFU300LD vs XPC755BPX300LE
MPC755BVT300LE 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 NXP Semiconductors PC755BMZFU300LD vs MPC755BVT300LE
PC755BVZFU300LD RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 Thales Group PC755BMZFU300LD vs PC755BVZFU300LD
MPC755BRX300 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Freescale Semiconductor PC755BMZFU300LD vs MPC755BRX300
IBM25PPC750L-DB0B300W RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM PC755BMZFU300LD vs IBM25PPC750L-DB0B300W
PCX755BMZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 Atmel Corporation PC755BMZFU300LD vs PCX755BMZFU300LE
MPC755BVT300 32-BIT, 300MHz, RISC PROCESSOR, PBGA360 NXP Semiconductors PC755BMZFU300LD vs MPC755BVT300
PCX755BMZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360 Thales Group PC755BMZFU300LD vs PCX755BMZFU300LE
PC755VZFU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 e2v technologies PC755BMZFU300LD vs PC755VZFU300LE
MPC755BRX300LE 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, CERAMIC, BGA-360 Motorola Mobility LLC PC755BMZFU300LD vs MPC755BRX300LE
Part Number Description Manufacturer Compare
MPC755BRX300LX 32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC PC755BMZFU300LD vs MPC755BRX300LX
PCX755MGSU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 e2v technologies PC755BMZFU300LD vs PCX755MGSU300LE
PCX755BVGHU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 e2v technologies PC755BMZFU300LD vs PCX755BVGHU300LE
PC745BVGU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA755, CERAMIC, BGA-755 e2v technologies PC755BMZFU300LD vs PC745BVGU300LE
PC755MGH300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 e2v technologies PC755BMZFU300LD vs PC755MGH300LE
PC755CMGU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, BGA-360 e2v technologies PC755BMZFU300LD vs PC755CMGU300LE
MPC755BRX300 32-BIT, 300MHz, RISC PROCESSOR, CBGA360 NXP Semiconductors PC755BMZFU300LD vs MPC755BRX300
XPC755BRX300LB RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Semiconductor Products PC755BMZFU300LD vs XPC755BRX300LB
PC755CVGHU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, BGA-360 e2v technologies PC755BMZFU300LD vs PC755CVGHU300LE
PC755MGHU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 e2v technologies PC755BMZFU300LD vs PC755MGHU300LE

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