Datasheets
PC755BMGSU350LE by:

RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360

Part Details for PC755BMGSU350LE by Atmel Corporation

Overview of PC755BMGSU350LE by Atmel Corporation

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Applications Education and Research Industrial Automation Telecommunications Electronic Manufacturing

Part Details for PC755BMGSU350LE

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PC755BMGSU350LE Part Data Attributes:

PC755BMGSU350LE Atmel Corporation
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PC755BMGSU350LE Atmel Corporation RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer ATMEL CORP
Part Package Code CGA
Package Description BGA, BGA360,19X19,50
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
JESD-609 Code e0
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 4.08 mm
Speed 350 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.8 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for PC755BMGSU350LE

This table gives cross-reference parts and alternative options found for PC755BMGSU350LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BMGSU350LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PC755BMGU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360 e2v technologies PC755BMGSU350LE vs PC755BMGU350LE
PCX755BVGU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies PC755BMGSU350LE vs PCX755BVGU350LE
PC755BVGU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 Atmel Corporation PC755BMGSU350LE vs PC755BVGU350LE
PC755BVGH350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360 e2v technologies PC755BMGSU350LE vs PC755BVGH350LE
PC755BVGU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360 e2v technologies PC755BMGSU350LE vs PC755BVGU350LE
PC755BVGHU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Atmel Corporation PC755BMGSU350LE vs PC755BVGHU350LE
PCX755BMGU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies PC755BMGSU350LE vs PCX755BMGU350LE
PCX755BMGHU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 e2v technologies PC755BMGSU350LE vs PCX755BMGHU350LE
PC755BMZF350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, FCBGA-360 e2v technologies PC755BMGSU350LE vs PC755BMZF350LE
PCX755BVGS350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CI-CGA-360 e2v technologies PC755BMGSU350LE vs PCX755BVGS350LE
Part Number Description Manufacturer Compare
PCX7447MGU600LB RISC Microprocessor, 32-Bit, 600MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation PC755BMGSU350LE vs PCX7447MGU600LB
TSXC750AVG12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group PC755BMGSU350LE vs TSXC750AVG12LH
TSPC750AMGU8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group PC755BMGSU350LE vs TSPC750AMGU8LE
FWPXA270C0E416 Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-360 Marvell Technology Group Ltd PC755BMGSU350LE vs FWPXA270C0E416
TSXPC750AMGSU/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation PC755BMGSU350LE vs TSXPC750AMGSU/T10LH
PPC7448HX1000NC 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor PC755BMGSU350LE vs PPC7448HX1000NC
MC7448VU867NC 32-BIT, 867MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 Freescale Semiconductor PC755BMGSU350LE vs MC7448VU867NC
TSPC750AMG8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group PC755BMGSU350LE vs TSPC750AMG8LH
TSXPC750AMG8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies PC755BMGSU350LE vs TSXPC750AMG8LE
TSXPC750AVGB/T8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation PC755BMGSU350LE vs TSXPC750AVGB/T8LE

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