PC755BMGSU350LE
vs
TSXPC750AMG8LE
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Transferred
Ihs Manufacturer
ATMEL CORP
Part Package Code
CGA
Package Description
BGA, BGA360,19X19,50
Pin Count
360
Reach Compliance Code
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
100 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-CBGA-B360
JESD-609 Code
e0
Length
25 mm
Low Power Mode
YES
Number of Terminals
360
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
Package Equivalence Code
BGA360,19X19,50
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
4.08 mm
Speed
350 MHz
Supply Voltage-Max
2.1 V
Supply Voltage-Min
1.8 V
Supply Voltage-Nom
2 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Base Number Matches
1
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