PC755BMGSU350LE vs MC7448VU867NC feature comparison

PC755BMGSU350LE Atmel Corporation

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MC7448VU867NC Freescale Semiconductor

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ATMEL CORP FREESCALE SEMICONDUCTOR INC
Part Package Code CGA LGA
Package Description BGA, BGA360,19X19,50 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360
Pin Count 360 360
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY LOW POWER TAKEN FROM SLEEP MODE
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES NO
Clock Frequency-Max 100 MHz 867 MHz
External Data Bus Width 64
Format FLOATING POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code S-CBGA-B360 S-CBGA-B360
JESD-609 Code e0 e1
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 360 360
Operating Temperature-Max 125 °C 105 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Equivalence Code BGA360,19X19,50 BGA360,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.08 mm 2.8 mm
Speed 350 MHz 867 MHz
Supply Voltage-Max 2.1 V 1.05 V
Supply Voltage-Min 1.8 V 0.95 V
Supply Voltage-Nom 2 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY OTHER
Terminal Finish Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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