Part Details for PC755BMZF350LE by e2v technologies
Overview of PC755BMZF350LE by e2v technologies
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Industrial Automation
Telecommunications
Electronic Manufacturing
Part Details for PC755BMZF350LE
PC755BMZF350LE CAD Models
PC755BMZF350LE Part Data Attributes
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PC755BMZF350LE
e2v technologies
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Datasheet
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PC755BMZF350LE
e2v technologies
RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, FCBGA-360
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | E2V TECHNOLOGIES PLC | |
Part Package Code | BGA | |
Package Description | BGA, BGA360,19X19,50 | |
Pin Count | 360 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 100 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B360 | |
Length | 25 mm | |
Low Power Mode | YES | |
Number of Terminals | 360 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA360,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.77 mm | |
Speed | 350 MHz | |
Supply Voltage-Max | 2.1 V | |
Supply Voltage-Min | 1.8 V | |
Supply Voltage-Nom | 2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PC755BMZF350LE
This table gives cross-reference parts and alternative options found for PC755BMZF350LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BMZF350LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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XPC755BRX350LB | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Semiconductor Products | PC755BMZF350LE vs XPC755BRX350LB |
PC755BMGU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360 | e2v technologies | PC755BMZF350LE vs PC755BMGU350LE |
PCX755BVGU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 | e2v technologies | PC755BMZF350LE vs PCX755BVGU350LE |
PCX755BMGH350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 | e2v technologies | PC755BMZF350LE vs PCX755BMGH350LE |
PCX755BVGHU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 | e2v technologies | PC755BMZF350LE vs PCX755BVGHU350LE |
PCX755BVGS350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CI-CGA-360 | e2v technologies | PC755BMZF350LE vs PCX755BVGS350LE |
PCX755BMGU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 | e2v technologies | PC755BMZF350LE vs PCX755BMGU350LE |
PC755BVGSU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CI-CGA-360 | e2v technologies | PC755BMZF350LE vs PC755BVGSU350LE |
XPC755BPX350LB | 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 | Motorola Mobility LLC | PC755BMZF350LE vs XPC755BPX350LB |
PC755BVGH350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Atmel Corporation | PC755BMZF350LE vs PC755BVGH350LE |