Part Details for PC755BVGH350LE by e2v technologies
Overview of PC755BVGH350LE by e2v technologies
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Industrial Automation
Telecommunications
Electronic Manufacturing
Part Details for PC755BVGH350LE
PC755BVGH350LE CAD Models
PC755BVGH350LE Part Data Attributes
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PC755BVGH350LE
e2v technologies
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Datasheet
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PC755BVGH350LE
e2v technologies
RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
Part Package Code | BGA | |
Package Description | BGA-360 | |
Pin Count | 360 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Additional Feature | ALSO REQUIRES 3.3V SUPPLY | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 100 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B360 | |
Length | 25 mm | |
Low Power Mode | YES | |
Number of Terminals | 360 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Equivalence Code | BGA360,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.24 mm | |
Speed | 350 MHz | |
Supply Voltage-Max | 2.1 V | |
Supply Voltage-Min | 1.8 V | |
Supply Voltage-Nom | 2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PC755BVGH350LE
This table gives cross-reference parts and alternative options found for PC755BVGH350LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PC755BVGH350LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
XPC755BRX350LB | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Motorola Semiconductor Products | PC755BVGH350LE vs XPC755BRX350LB |
PC755BMGU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, BGA-360 | e2v technologies | PC755BVGH350LE vs PC755BMGU350LE |
PC755BMZF350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, FCBGA-360 | e2v technologies | PC755BVGH350LE vs PC755BMZF350LE |
PCX755BVGU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 | e2v technologies | PC755BVGH350LE vs PCX755BVGU350LE |
PCX755BMGH350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 | e2v technologies | PC755BVGH350LE vs PCX755BMGH350LE |
PCX755BVGHU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, BGA-360 | e2v technologies | PC755BVGH350LE vs PCX755BVGHU350LE |
PCX755BVGS350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CI-CGA-360 | e2v technologies | PC755BVGH350LE vs PCX755BVGS350LE |
PCX755BMGU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CERAMIC, BGA-360 | e2v technologies | PC755BVGH350LE vs PCX755BMGU350LE |
PC755BVGSU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, CI-CGA-360 | e2v technologies | PC755BVGH350LE vs PC755BVGSU350LE |
XPC755BPX350LB | 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 | Motorola Mobility LLC | PC755BVGH350LE vs XPC755BPX350LB |