PC755BMGSU350LE vs PCX755BVGS350LE feature comparison

PC755BMGSU350LE Atmel Corporation

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PCX755BVGS350LE

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Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer ATMEL CORP
Part Package Code CGA
Package Description BGA, BGA360,19X19,50
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
JESD-609 Code e0
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 4.08 mm
Speed 350 MHz
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.8 V
Supply Voltage-Nom 2 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Base Number Matches 1

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