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BGS13SN8E6327XTSA1
Infineon Technologies AG
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$0.3185 | Yes | Yes | Active | MOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XBCC-B8 | e3 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | UNSPECIFIED | BCC | SQUARE | CHIP CARRIER | YES | Tin (Sn) | BUTT | 400 µm | BOTTOM | 1.1 mm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | BCC, | compliant | 8542.39.00.01 | Infineon | |||||||||||||||||||||||
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HT2MOA4S20/E/3/RJ
NXP Semiconductors
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$0.3238 | Yes | Active | HYBRID | TELECOM CIRCUIT | e4 | Not Qualified | NOT SPECIFIED | NOT SPECIFIED | PLASTIC/EPOXY | MODULE(UNSPEC) | MICROELECTRONIC ASSEMBLY | Silver (Ag) | NXP SEMICONDUCTORS | compliant | NXP | COB | 35 | SOT500-2 | |||||||||||||||||||||||||||||||||||||
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AP2281-3FMG-7
Diodes Incorporated
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$0.3252 | Yes | Yes | Active | 1.8 V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 1 | R-PDSO-N6 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SOLCC6,.07,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 1.81 mm | 2 mm | 605 µm | DIODES INC | HVSON, | compliant | 8542.39.00.01 | Diodes Incorporated | DFN | 6 | EAR99 | NO | 6 V | 1.5 V | |||||||||||||||||
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BGS13GA14E6327XTSA1
Infineon Technologies AG
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$0.3264 | Yes | Yes | Obsolete | 3 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XBCC-B14 | e4 | 1 | 85 °C | -40 °C | 14 | UNSPECIFIED | BCC | SQUARE | CHIP CARRIER | YES | GOLD NICKEL | BUTT | 400 µm | BOTTOM | 2 mm | 2 mm | 650 µm | INFINEON TECHNOLOGIES AG | ATSLP-14 | compliant | 8542.39.00.01 | Infineon | ||||||||||||||||||||||||
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AP2281-1FMG-7
Diodes Incorporated
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$0.3374 | Yes | Yes | Active | 1.8 V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 1 | R-PDSO-N6 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SOLCC6,.07,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 1.81 mm | 2 mm | 605 µm | DIODES INC | DFN-6 | compliant | 8542.39.00.01 | Diodes Incorporated | DFN | 6 | EAR99 | NO | 6 V | 1.5 V | |||||||||||||||||
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ATA8401C-6AQY-66
Microchip Technology Inc
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$0.3380 | Yes | Active | 3 V | TELECOM CIRCUIT | 1 | 11.6 µA | INDUSTRIAL | S-PDSO-G8 | e3 | Not Qualified | 85 °C | -55 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.05 mm | MICROCHIP TECHNOLOGY INC | LEAD FREE, TSSOP-8 | compliant | 8542.31.00.01 | Microchip | 5A991.G | |||||||||||||||||||||||
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BGS14GA14E6327XTSA1
Infineon Technologies AG
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$0.3397 | Yes | Yes | Obsolete | 3 V | TELECOM CIRCUIT | 1 | OTHER | S-XQMA-B14 | e4 | 1 | 85 °C | -30 °C | 14 | UNSPECIFIED | SQUARE | MICROELECTRONIC ASSEMBLY | YES | GOLD NICKEL | BUTT | QUAD | 2 mm | 2 mm | 650 µm | INFINEON TECHNOLOGIES AG | ROHS COMPLIANT, ATSLP-14 | compliant | 8542.39.00.01 | Infineon | |||||||||||||||||||||||||||
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SL2S5002FTB,115
NXP Semiconductors
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$0.3411 | Yes | Active | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N3 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 3 | PLASTIC/EPOXY | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 550 µm | DUAL | 1 mm | 1.45 mm | 500 µm | NXP SEMICONDUCTORS | 1.45 X 1 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT1122, XSON-3 | compliant | NXP | SON | 3 | SOT1122 | ||||||||||||||||||||||
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AT88RF04C-MVA1
Microchip Technology Inc
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$0.3444 | Yes | Not Recommended | CMOS | SYNCHRONOUS | 1 | R-XXMA-N | 70 °C | -25 °C | UNSPECIFIED | XMA | RECTANGULAR | MICROELECTRONIC ASSEMBLY | YES | NO LEAD | UNSPECIFIED | MICROCHIP TECHNOLOGY INC | compliant | 8523.52.00.90 | Microchip | 5A992.C | 4.096 kbit | CRYPTO MEMORY | 8 | 512 words | 512 | 512X8 | |||||||||||||||||||||||||||||
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HTSH5601ETK,118
NXP Semiconductors
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$0.3486 | Yes | Active | TELECOM CIRCUIT | 1 | OTHER | R-PDSO-N2 | Not Qualified | 1 | 85 °C | -25 °C | 260 | 30 | 2 | PLASTIC/EPOXY | SON | LCC2(UNSPEC) | RECTANGULAR | SMALL OUTLINE | YES | NO LEAD | DUAL | NXP SEMICONDUCTORS | 3 X 2 MM, 0.85 MM HEIGHT, PLASTIC, SOT899-1, HVSON-2 | compliant | NXP | SON | 2 | SOT899-1 |