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SL3S1013FTB0,115
NXP Semiconductors
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$0.2596 | Yes | Active | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N6 | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 6 | PLASTIC/EPOXY | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | NO LEAD | 500 µm | DUAL | 1 mm | 1.45 mm | 500 µm | NXP SEMICONDUCTORS | SON | 1.45 X 1 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-252, SOT886F1, XSON-6 | 6 | SOT886 | compliant | 8542.32.00 | NXP | ||||||||||||||||
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AP22804AM8-13
Diodes Incorporated
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$0.2629 | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | S-PDSO-G8 | e3 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.1 mm | DIODES INC | , | compliant | 8542.39.00.01 | Diodes Incorporated | EAR99 | |||||||||||||||||
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AP22804BW5-7
Diodes Incorporated
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$0.2664 | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G5 | e3 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.4 mm | DIODES INC | SOT-25,5 PIN | compliant | 8542.39.00.01 | Diodes Incorporated | EAR99 | |||||||||||||||||
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ATA5577M1330C-DDB
Microchip Technology Inc
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$0.2714 | Yes | Active | 3.6 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | Not Qualified | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | compliant | 8523.59.00.00 | Microchip | 5A991.G | ||||||||||||||||||||||||
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HTMS8001FTK/AF,115
NXP Semiconductors
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$0.2745 | Yes | Obsolete | CMOS | TELECOM CIRCUIT | Not Qualified | 1 | 260 | PLASTIC/EPOXY | QCCN | LCC(UNSPEC) | CHIP CARRIER | YES | NO LEAD | QUAD | NXP SEMICONDUCTORS | SON | 2 | SOT899-1 | compliant | NXP | ||||||||||||||||||||||||||||
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AP2280-2FMG-7
Diodes Incorporated
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$0.2778 | Yes | Yes | Active | 1.8 V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 1 | R-PDSO-N6 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SOLCC6,.07,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 1.8125 mm | 2.0125 mm | 605 µm | DIODES INC | DFN | DFN-6 | 6 | compliant | 8542.39.00.01 | Diodes Incorporated | EAR99 | NO | 6 V | 1.5 V | ||||||||||
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ATECC508A-SSHCZ-B
Microchip Technology Inc
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$0.2788 | Yes | Yes | Not Recommended | 3.6 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G8 | e4 | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 3.9 mm | 4.9 mm | 1.75 mm | MICROCHIP TECHNOLOGY INC | SOIC-8 | compliant | Microchip | |||||||||||||||||
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ATECC508A-MAHCZ-T
Microchip Technology Inc
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$0.2798 | Yes | Yes | Not Recommended | 3.6 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N8 | e4 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 2 mm | 3 mm | 600 µm | MICROCHIP TECHNOLOGY INC | UDFN-8 | compliant | 8542.31.00.01 | Microchip | 5A992.C | ||||||||||||
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AP22804BSN-7
Diodes Incorporated
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$0.2815 | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PDSO-N6 | e4 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 650 µm | DUAL | 2 mm | 2 mm | 630 µm | DIODES INC | UDFN-6 | compliant | 8542.39.00.01 | Diodes Incorporated | EAR99 | |||||||||||||||||
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AP22811AW5-7
Diodes Incorporated
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$0.2824 | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G5 | e3 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.4 mm | DIODES INC | SOT25, 5 PIN | compliant | 8542.39.00.01 | Diodes Incorporated | EAR99 |