Datasheets
70V7339S200BC8 by:

CABGA-256, Reel

Part Details for 70V7339S200BC8 by Integrated Device Technology Inc

Overview of 70V7339S200BC8 by Integrated Device Technology Inc

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Applications Internet of Things (IoT) Environmental Monitoring Industrial Automation Financial Technology (Fintech) Smart Cities Energy and Power Systems Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Renewable Energy Entertainment and Gaming

Part Details for 70V7339S200BC8

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70V7339S200BC8 Part Data Attributes:

70V7339S200BC8 Integrated Device Technology Inc
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70V7339S200BC8 Integrated Device Technology Inc CABGA-256, Reel
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA
Package Description 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
Pin Count 256
Manufacturer Package Code BC256
Reach Compliance Code not_compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 10 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code S-PBGA-B256
JESD-609 Code e0
Length 17 mm
Memory Density 9437184 bit
Memory IC Type MULTI-PORT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 2
Number of Terminals 256
Number of Words 524288 words
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Standby Current-Max 0.03 A
Standby Voltage-Min 3.15 V
Supply Current-Max 0.95 mA
Supply Voltage-Max (Vsup) 3.45 V
Supply Voltage-Min (Vsup) 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 17 mm

Alternate Parts for 70V7339S200BC8

This table gives cross-reference parts and alternative options found for 70V7339S200BC8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70V7339S200BC8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
70V7339S200BC CABGA-256, Tray Integrated Device Technology Inc 70V7339S200BC8 vs 70V7339S200BC
70V7339S200BC 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM, CABGA90/Tray Renesas Electronics Corporation 70V7339S200BC8 vs 70V7339S200BC
70V7339S200BCG CABGA-256, Tray Integrated Device Technology Inc 70V7339S200BC8 vs 70V7339S200BCG
70V7339S200BC8 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM, CABGA0/Reel Renesas Electronics Corporation 70V7339S200BC8 vs 70V7339S200BC8
IDT70V7339S200BC Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 Integrated Device Technology Inc 70V7339S200BC8 vs IDT70V7339S200BC
70V7339S200BCG 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM, CABGA90/Tray Renesas Electronics Corporation 70V7339S200BC8 vs 70V7339S200BCG
Part Number Description Manufacturer Compare
70T633S8BCG Dual-Port SRAM, 512KX18, 8ns, CMOS, PBGA256, 17 X 17 MM, 1.40 HEIGHT, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70V7339S200BC8 vs 70T633S8BCG
IDT70T633S8BCG Dual-Port SRAM, 512KX18, 8ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HIEGHT, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70V7339S200BC8 vs IDT70T633S8BCG
CYD09S18V-133BBC Dual-Port SRAM, 512KX18, 4.7ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256 Cypress Semiconductor 70V7339S200BC8 vs CYD09S18V-133BBC
72T631S12BCG Dual-Port SRAM, 256KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 HEIGHT, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70V7339S200BC8 vs 72T631S12BCG
70T633S10BCI8 512K x 18, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel Renesas Electronics Corporation 70V7339S200BC8 vs 70T633S10BCI8
70V7339S200BCG CABGA-256, Tray Integrated Device Technology Inc 70V7339S200BC8 vs 70V7339S200BCG
70V7339S200BC 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM, CABGA90/Tray Renesas Electronics Corporation 70V7339S200BC8 vs 70V7339S200BC
70V7339S133BCI 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM, CABGA90/Tray Renesas Electronics Corporation 70V7339S200BC8 vs 70V7339S133BCI
70V7339S133BCI8 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM, CABGA0/Reel Renesas Electronics Corporation 70V7339S200BC8 vs 70V7339S133BCI8
IDT70V7319S200BCG8 Dual-Port SRAM, 256KX18, 10ns, PBGA256, BGA-256 Integrated Device Technology Inc 70V7339S200BC8 vs IDT70V7319S200BCG8

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