Findchips: Parametric Search Results for 70V7339S200BC8


Select Parts		Part Number

		70V7339S200BC8 Integrated Device Technology Inc
		70V7339S200BC8 Renesas Electronics Corporation
		IDT70V7339S200BC8 Integrated Device Technology Inc

				Most Relevant						Technical																	Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$98.6454

Transferred

9.4372 Mbit

512KX18

3.3 V

10 ns

200 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.15 V

950 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B256

Not Qualified

70 °C

225

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256

256

BC256

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

End Of Life

9.4372 Mbit

512KX18

3.3 V

10 ns

200 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.15 V

950 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B256

Not Qualified

70 °C

225

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.5 mm

17 mm

RENESAS ELECTRONICS CORP

CABGA

256

BC256

not_compliant

NLR

8542320041

Renesas Electronics

Check for Price

Transferred

9.4372 Mbit

512KX18

3.3 V

10 ns

200 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.15 V

950 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B256

Not Qualified

70 °C

225

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

Tin/Lead (Sn63Pb37)

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA, BGA256,16X16,40

256

not_compliant

3A991.B.2.A

8542.32.00.41

Compare

70V7339S200BC8

Integrated Device Technology Inc

$98.6454

Transferred

9.4372 Mbit

512KX18

3.3 V

10 ns

200 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.15 V

950 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B256

Not Qualified

70 °C

225

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256

256

BC256

not_compliant

3A991.B.2.A

8542.32.00.41

70V7339S200BC8

Renesas Electronics Corporation

Check for Price

End Of Life

9.4372 Mbit

512KX18

3.3 V

10 ns

200 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.15 V

950 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B256

Not Qualified

70 °C

225

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.5 mm

17 mm

RENESAS ELECTRONICS CORP

CABGA

256

BC256

not_compliant

NLR

8542320041

Renesas Electronics

IDT70V7339S200BC8

Integrated Device Technology Inc

Check for Price

Transferred

9.4372 Mbit

512KX18

3.3 V

10 ns

200 MHz

MULTI-PORT SRAM

FLOW-THROUGH OR PIPELINED ARCHITECTURE

COMMON

512000

524.288 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.15 V

950 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B256

Not Qualified

70 °C

225

256

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

YES

Tin/Lead (Sn63Pb37)

BALL

1 mm

BOTTOM

1.5 mm

17 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LBGA, BGA256,16X16,40

256

not_compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: 70V7339S200BC8 under SRAMs