Datasheets
70T633S10BCI8 by:

512K x 18, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel

Part Details for 70T633S10BCI8 by Renesas Electronics Corporation

Overview of 70T633S10BCI8 by Renesas Electronics Corporation

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Applications Internet of Things (IoT) Environmental Monitoring Industrial Automation Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Renewable Energy Entertainment and Gaming Robotics and Drones

Price & Stock for 70T633S10BCI8

Part # Distributor Description Stock Price Buy
DISTI # 70T633S10BCI8-ND
DigiKey IC SRAM 9MBIT PARALLEL 256CABGA Min Qty: 1000 Lead time: 18 Weeks Container: Tape & Reel (TR) Limited Supply - Call
  • 1,000 $269.5768
$269.5768 Buy Now
DISTI # 70T633S10BCI8
Avnet Americas 512K x 18, 3.3V/2.5V Dual-Port RAM, Interleaved I/O's - Tape and Reel (Alt: 70T633S10BCI8) RoHS: Not Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 26 Weeks, 1 Days Container: Reel 0
  • 1,000 $303.6010
  • 2,000 $297.3196
  • 4,000 $291.0382
  • 6,000 $284.7568
  • 8,000 $278.4754
  • 10,000 $272.1940
  • 100,000 $265.9126
$265.9126 / $303.6010 Buy Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Container: Reel 0
Reel
  • 1,000 $271.9300
$271.9300 Buy Now

Part Details for 70T633S10BCI8

70T633S10BCI8 CAD Models

70T633S10BCI8 Part Data Attributes:

70T633S10BCI8 Renesas Electronics Corporation
Buy Now Datasheet
Compare Parts:
70T633S10BCI8 Renesas Electronics Corporation 512K x 18, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel
Pbfree Code No
Rohs Code No
Part Life Cycle Code End Of Life
Ihs Manufacturer RENESAS ELECTRONICS CORP
Part Package Code CABGA
Pin Count 256
Manufacturer Package Code BC256
Reach Compliance Code not_compliant
ECCN Code NLR
HTS Code 8542320041
Factory Lead Time 26 Weeks, 1 Day
Samacsys Manufacturer Renesas Electronics
Access Time-Max 10 ns
I/O Type COMMON
JESD-30 Code S-PBGA-B256
JESD-609 Code e0
Length 17 mm
Memory Density 9437184 bit
Memory IC Type MULTI-PORT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 2
Number of Terminals 256
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 2.4 V
Supply Current-Max 0.445 mA
Supply Voltage-Max (Vsup) 2.6 V
Supply Voltage-Min (Vsup) 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 17 mm

Alternate Parts for 70T633S10BCI8

This table gives cross-reference parts and alternative options found for 70T633S10BCI8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 70T633S10BCI8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
70T633S10BCGI CABGA-256, Tray Integrated Device Technology Inc 70T633S10BCI8 vs 70T633S10BCGI
70T633S10BCI 512K x 18, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA90/Tray Renesas Electronics Corporation 70T633S10BCI8 vs 70T633S10BCI
IDT70T633S10BCGI Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HIEGHT, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70T633S10BCI8 vs IDT70T633S10BCGI
70T633S10BCI CABGA-256, Tray Integrated Device Technology Inc 70T633S10BCI8 vs 70T633S10BCI
70T633S10BCI8 CABGA-256, Reel Integrated Device Technology Inc 70T633S10BCI8 vs 70T633S10BCI8
Part Number Description Manufacturer Compare
AS9C25256M2018L-133BC Dual-Port SRAM, 256KX18, 12ns, CMOS, PBGA256, BGA-256 Integrated Silicon Solution Inc 70T633S10BCI8 vs AS9C25256M2018L-133BC
IDT70T633S8BCG Dual-Port SRAM, 512KX18, 8ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HIEGHT, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70T633S10BCI8 vs IDT70T633S8BCG
72T631S12BCG Dual-Port SRAM, 256KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 HEIGHT, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70T633S10BCI8 vs 72T631S12BCG
CYD09S18V-100BBC Dual-Port SRAM, 512KX18, 4.7ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256 Cypress Semiconductor 70T633S10BCI8 vs CYD09S18V-100BBC
70V7339S200BCG 512K x 18 Synchronous Bank-Switchable Dual-Port SRAM, CABGA90/Tray Renesas Electronics Corporation 70T633S10BCI8 vs 70V7339S200BCG
70V7339S133BCI8 CABGA-256, Reel Integrated Device Technology Inc 70T633S10BCI8 vs 70V7339S133BCI8
70T633S10BC8 512K x 18, 3.3V/2.5V Dual-Port RAM, Interleaved I/O''s, CABGA0/Reel Renesas Electronics Corporation 70T633S10BCI8 vs 70T633S10BC8
AS9C25512M2018L-166BI Dual-Port SRAM, 512KX18, 10ns, CMOS, PBGA256, BGA-256 Integrated Silicon Solution Inc 70T633S10BCI8 vs AS9C25512M2018L-166BI
70V7319S166BCGI CABGA-256, Tray Integrated Device Technology Inc 70T633S10BCI8 vs 70V7319S166BCGI
IDT70T633S12BCGI Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HIEGHT, 1 MM PITCH, GREEN, BGA-256 Integrated Device Technology Inc 70T633S10BCI8 vs IDT70T633S12BCGI

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