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31 - 40 of 45,174 results
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AP2280-2WG-7
Diodes Incorporated
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$0.2931 | Yes | Yes | Active | 1.8 V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 1 | R-PDSO-G5 | 3 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.45 mm | DIODES INC | SOT | SOT-25, 5 PIN | 5 | compliant | EAR99 | 8542.39.00.01 | NO | 6 V | 1.5 V | ||||||||||||||||||
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AT88SC0808CRF-MR1
Microchip Technology Inc
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$0.3006 | Yes | Not Recommended | CMOS | SYNCHRONOUS | 1 | e4 | 70 °C | UNSPECIFIED | RECTANGULAR | Nickel/Gold (Ni/Au) | MICROCHIP TECHNOLOGY INC | GREEN PACKAGE-2 | compliant | 5A992.C | 8523.52.00.90 | Microchip | 8.192 kbit | CRYPTORF MEMORY | 8 | 1.024 k | 1000 | 1KX8 | |||||||||||||||||||||||||||||||||
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AP22814AW5-7
Diodes Incorporated
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$0.3056 | Yes | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G5 | e3 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.4 mm | DIODES INC | SOT-25,5 PIN | compliant | EAR99 | 8542.39.00.01 | ||||||||||||||||||||||||
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AT88SC0808CRF-MVA1
Microchip Technology Inc
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$0.3126 | Yes | Not Recommended | CMOS | SYNCHRONOUS | 1 | OTHER | e4 | 70 °C | -25 °C | UNSPECIFIED | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Nickel/Gold (Ni/Au) | MICROCHIP TECHNOLOGY INC | compliant | 5A992.C | 8523.52.00.90 | 8.192 kbit | CRYPTO MEMORY | 8 | 1.024 k | 1000 | 1KX8 | 1 | |||||||||||||||||||||||||||||||
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AP22814BM8-13
Diodes Incorporated
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$0.3139 | Yes | Active | TELECOM CIRCUIT | e3 | 260 | 30 | MATTE TIN | DIODES INC | , | compliant | EAR99 | 8542.39.00.01 | |||||||||||||||||||||||||||||||||||||||||||
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ATR4253C-PVQW-1
Microchip Technology Inc
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$0.3155 | Yes | Active | 10 V | BICMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N16 | 115 °C | -40 °C | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 3 mm | 3 mm | 900 µm | MICROCHIP TECHNOLOGY INC | 3 X 3 MM, VQFN-16 | compliant | |||||||||||||||||||||||||||||
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BGS13SN8E6327XTSA1
Infineon Technologies AG
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$0.3164 | Yes | Yes | Active | MOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XBCC-B8 | e3 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | UNSPECIFIED | BCC | SQUARE | CHIP CARRIER | YES | Tin (Sn) | BUTT | 400 µm | BOTTOM | 1.1 mm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | BCC, | compliant | 8542.39.00.01 | Infineon | |||||||||||||||||||||||
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HT2MOA4S20/E/3/RJ
NXP Semiconductors
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$0.3232 | Yes | Active | HYBRID | TELECOM CIRCUIT | e4 | Not Qualified | NOT SPECIFIED | NOT SPECIFIED | PLASTIC/EPOXY | MODULE(UNSPEC) | MICROELECTRONIC ASSEMBLY | Silver (Ag) | NXP SEMICONDUCTORS | COB | 35 | compliant | NXP | SOT500-2 | |||||||||||||||||||||||||||||||||||||
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AP2281-3FMG-7
Diodes Incorporated
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$0.3256 | Yes | Yes | Active | 1.8 V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 1 | R-PDSO-N6 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SOLCC6,.07,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 1.81 mm | 2 mm | 605 µm | DIODES INC | DFN | HVSON, | 6 | compliant | EAR99 | 8542.39.00.01 | NO | 6 V | 1.5 V | ||||||||||||||||||
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BGS13GA14E6327XTSA1
Infineon Technologies AG
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$0.3264 | Yes | Yes | Obsolete | 3 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XBCC-B14 | e4 | 1 | 85 °C | -40 °C | 14 | UNSPECIFIED | BCC | SQUARE | CHIP CARRIER | YES | GOLD NICKEL | BUTT | 400 µm | BOTTOM | 2 mm | 2 mm | 650 µm | INFINEON TECHNOLOGIES AG | ATSLP-14 | compliant | 8542.39.00.01 | Infineon |