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Parametric results for: Other Telecom ICs

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CPC7583BC-TR
 IXYS Integrated Circuits Division 		Check for Price Yes Yes Obsolete 5 V TELECOM CIRCUIT 1 1.9 µA INDUSTRIAL R-PDSO-G28 e3 Not Qualified 1 85 °C -40 °C 260 30 28 PLASTIC/EPOXY SOP SOP28,.4 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 7.5 mm 18.034 mm 2.642 mm IXYS INTEGRATED CIRCUITS DIVISION SOIC SOP, SOP28,.4 28 unknown 8542.39.00.01
MC2045-3DIEWP
 Mindspeed Technologies Inc 		Check for Price Obsolete 3.3 V BICMOS TELECOM CIRCUIT 1 INDUSTRIAL R-XUUC-N21 Not Qualified 85 °C -40 °C 21 UNSPECIFIED DIE RECTANGULAR UNCASED CHIP YES NO LEAD UPPER MINDSPEED TECHNOLOGIES INC DIE DIE, 21 compliant 8542.39.00.01
MT9196ASR1
 Microsemi Corporation 		Check for Price Yes Yes Obsolete 5 V CMOS TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-G28 e3 Not Qualified 85 °C -40 °C 28 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 7.5 mm 17.9 mm 2.65 mm MICROSEMI CORP SOIC 0.300 INCH, LEAD FREE, MS-013AE, SOIC-28 28 compliant 8542.39.00.01
SL3S1213FTB0
 NXP Semiconductors 		Check for Price Yes Yes Obsolete 1.8 V CMOS TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-N6 e3 Not Qualified 1 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 6 PLASTIC/EPOXY VSON RECTANGULAR SMALL OUTLINE, VERY THIN PROFILE YES Tin (Sn) NO LEAD 500 µm DUAL 1 mm 1.45 mm 500 µm NXP SEMICONDUCTORS SON 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 6 unknown 8542.39.00.01
KGA4153
 LAPIS Semiconductor Co Ltd 		Check for Price Yes Transferred 3.3 V GAAS TELECOM CIRCUIT 1 80 µA OTHER R-XUUC-N Not Qualified 85 °C -10 °C UNSPECIFIED DIE DIE OR CHIP RECTANGULAR UNCASED CHIP YES NO LEAD UPPER LAPIS SEMICONDUCTOR CO LTD DIE DIE, DIE OR CHIP unknown 8542.39.00.01
TS81102G0MFS9NB2
 e2v technologies 		Check for Price Obsolete 5 V TELECOM CIRCUIT 1 MILITARY S-CQFP-G196 Not Qualified 125 °C -55 °C 196 CERAMIC, METAL-SEALED COFIRED HQFP SQUARE FLATPACK, HEAT SINK/SLUG YES GULL WING 635 µm QUAD 33.91 mm 33.91 mm 3.4 mm E2V TECHNOLOGIES PLC QFP HQFP, 196 compliant 8542.39.00.01
RFHA1003SR
 RF Micro Devices Inc 		Check for Price Yes Transferred TELECOM CIRCUIT 1 INDUSTRIAL R-CDSO-N8 85 °C -40 °C 8 CERAMIC, METAL-SEALED COFIRED HSON RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG YES NO LEAD 1.27 mm DUAL 5.029 mm 5.994 mm 1.981 mm RF MICRO DEVICES INC HSON, unknown 8542.33.00.01 EAR99
L8001G-R20-T
 Unisonic Technologies Co Ltd 		Check for Price Yes Active CMOS TELECOM CIRCUIT 1 OTHER R-PDSO-G20 80 °C -40 °C NOT SPECIFIED NOT SPECIFIED 20 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING DUAL UNISONIC TECHNOLOGIES CO LTD 0.150 INCH, HALOGEN FREE, SSOP-20 compliant 8542.39.00.01
TK10652MCTL
 TOKO Inc 		Check for Price Obsolete 5 V TELECOM CIRCUIT 1 6.5 mA OTHER R-PDSO-G20 Not Qualified 85 °C -35 °C 20 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 1 mm DUAL 4.4 mm 10.2 mm 1.8 mm TOKO INC SSOP, unknown 8542.39.00.01
SI5383B-D07131-GMR
 Skyworks Solutions Inc 		Check for Price Yes Active 1.8 V TELECOM CIRCUIT Also Require 3.3V Supply 1 S-XBGA-N56 e4 3 85 °C -40 °C 260 40 56 UNSPECIFIED VFLGA LGA56,14X14,20 SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES NICKEL GOLD NO LEAD 500 µm BOTTOM 8 mm 8 mm 1 mm SKYWORKS SOLUTIONS INC LGA-56 unknown
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