Part Details for TC55V16176FF-133 by Toshiba America Electronic Components
Overview of TC55V16176FF-133 by Toshiba America Electronic Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TC55V16176FF-133
TC55V16176FF-133 CAD Models
TC55V16176FF-133 Part Data Attributes:
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TC55V16176FF-133
Toshiba America Electronic Components
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Datasheet
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TC55V16176FF-133
Toshiba America Electronic Components
IC 1M X 18 CACHE SRAM, 4.2 ns, PQFP100, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TOSHIBA CORP | |
Part Package Code | QFP | |
Package Description | LQFP, QFP100,.63X.87 | |
Pin Count | 100 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 4.2 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 133 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PQFP-G100 | |
JESD-609 Code | e0 | |
Length | 20 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | CACHE SRAM | |
Memory Width | 18 | |
Number of Functions | 1 | |
Number of Terminals | 100 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 1MX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LQFP | |
Package Equivalence Code | QFP100,.63X.87 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.7 mm | |
Standby Current-Max | 0.01 A | |
Standby Voltage-Min | 3.14 V | |
Supply Current-Max | 0.38 mA | |
Supply Voltage-Max (Vsup) | 3.465 V | |
Supply Voltage-Min (Vsup) | 3.135 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Width | 14 mm |
Alternate Parts for TC55V16176FF-133
This table gives cross-reference parts and alternative options found for TC55V16176FF-133. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC55V16176FF-133, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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MT58L256V18PB-4.4 | Standard SRAM, 256KX18, 2.9ns, CMOS, PBGA119, 14 X 22 MM, BGA-119 | Micron Technology Inc | TC55V16176FF-133 vs MT58L256V18PB-4.4 |
IS61VF204818A-7.5B3I | Cache SRAM, 2MX18, 7.5ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, BGA-165 | Integrated Silicon Solution Inc | TC55V16176FF-133 vs IS61VF204818A-7.5B3I |
71V2546XS150BGG8 | ZBT SRAM, 128KX36, 3.8ns, CMOS, PBGA119, GREEN, BGA-119 | Integrated Device Technology Inc | TC55V16176FF-133 vs 71V2546XS150BGG8 |
CY7C1372AV25-100BGC | ZBT SRAM, 1MX18, 5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, FBGA-119 | Cypress Semiconductor | TC55V16176FF-133 vs CY7C1372AV25-100BGC |
UPD44164364F5-E30-EQ1 | DDR SRAM, 512KX36, 0.27ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, FBGA-165 | NEC Electronics Group | TC55V16176FF-133 vs UPD44164364F5-E30-EQ1 |
MC803256K36L-7R5I | Cache SRAM, 512KX36, 4.5ns, CMOS, PQFP100, LQFP-100 | MoSys Inc | TC55V16176FF-133 vs MC803256K36L-7R5I |
K7B401825A-TC65 | Cache SRAM, 256KX18, 6.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 | Samsung Semiconductor | TC55V16176FF-133 vs K7B401825A-TC65 |
MT58V2MV18FF-7.5 | Standard SRAM, 2MX18, 7.5ns, CMOS, PBGA165, 13 X 15 MM, MO-216, FBGA-165 | Micron Technology Inc | TC55V16176FF-133 vs MT58V2MV18FF-7.5 |
CY7C1321V18-250BZC | DDR SRAM, 512KX36, 0.35ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 | Cypress Semiconductor | TC55V16176FF-133 vs CY7C1321V18-250BZC |
IS61DDB251236A-300B4I | DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | TC55V16176FF-133 vs IS61DDB251236A-300B4I |