TC55V16176FF-133 vs IS61DDB251236A-300B4I feature comparison

TC55V16176FF-133 Toshiba America Electronic Components

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IS61DDB251236A-300B4I Integrated Silicon Solution Inc

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP INTEGRATED SILICON SOLUTION INC
Part Package Code QFP BGA
Package Description LQFP, QFP100,.63X.87 LBGA,
Pin Count 100 165
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 4.2 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100 R-PBGA-B165
JESD-609 Code e0
Length 20 mm 15 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type CACHE SRAM DDR SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 100 165
Number of Words 1048576 words 524288 words
Number of Words Code 1000000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX18 512KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LBGA
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.7 mm 1.4 mm
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.38 mA
Supply Voltage-Max (Vsup) 3.465 V 1.89 V
Supply Voltage-Min (Vsup) 3.135 V 1.71 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1 mm
Terminal Position QUAD BOTTOM
Width 14 mm 13 mm
Base Number Matches 1 1

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Compare IS61DDB251236A-300B4I with alternatives