Datasheets
TC5563APL-10 by: Toshiba America Electronic Components

IC 8K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.300 INCH, SLIM, PLASTIC, DIP-28, Static RAM

Part Details for TC5563APL-10 by Toshiba America Electronic Components

Overview of TC5563APL-10 by Toshiba America Electronic Components

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Part Details for TC5563APL-10

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TC5563APL-10 Part Data Attributes:

TC5563APL-10 Toshiba America Electronic Components
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TC5563APL-10 Toshiba America Electronic Components IC 8K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.300 INCH, SLIM, PLASTIC, DIP-28, Static RAM
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer TOSHIBA CORP
Part Package Code DIP
Package Description DIP, DIP28,.3
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 100 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T28
JESD-609 Code e0
Length 34.9 mm
Memory Density 65536 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 28
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 8KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.45 mm
Standby Current-Max 0.0001 A
Standby Voltage-Min 2 V
Supply Current-Max 0.045 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for TC5563APL-10

This table gives cross-reference parts and alternative options found for TC5563APL-10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC5563APL-10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MSM5165AL-10RS Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 OKI Electric Industry Co Ltd TC5563APL-10 vs MSM5165AL-10RS
CXK5864BSP-10L Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, MO-058AB, DIP-28 Sony Semiconductor TC5563APL-10 vs CXK5864BSP-10L
MS6264NL-10PC Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Mosel Vitelic Corporation TC5563APL-10 vs MS6264NL-10PC
U6264ADK10 Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 ZMDI TC5563APL-10 vs U6264ADK10
MS6264CLL-10PC Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Mosel Vitelic Corporation TC5563APL-10 vs MS6264CLL-10PC
HY6264ALP-10I Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 SK Hynix Inc TC5563APL-10 vs HY6264ALP-10I
HY6264AP-100 Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 SK Hynix Inc TC5563APL-10 vs HY6264AP-100
KM6264AL-10L Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Samsung Semiconductor TC5563APL-10 vs KM6264AL-10L
U6264ADG10L Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 ZMDI TC5563APL-10 vs U6264ADG10L
U6264ADG10LL Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 ZMDI TC5563APL-10 vs U6264ADG10LL
Part Number Description Manufacturer Compare
EDI8832P70CI Standard SRAM, 32KX8, 70ns, CMOS, CDIP28, Electronic Designs Inc TC5563APL-10 vs EDI8832P70CI
MSM832GI-10 Standard SRAM, 32KX8, 100ns, CMOS, CDFP28 Mosaic Semiconductor Inc TC5563APL-10 vs MSM832GI-10
WS512K32-35NH1I SRAM Module, 512KX32, 35ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp TC5563APL-10 vs WS512K32-35NH1I
WS128K32-15G2UMA SRAM Module, 128KX32, 15ns, CMOS, CQFP68, 22.40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68 Mercury Systems Inc TC5563APL-10 vs WS128K32-15G2UMA
MCM6209P20 64KX4 STANDARD SRAM, 20ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Motorola Mobility LLC TC5563APL-10 vs MCM6209P20
WS128K32-120HSM SRAM Module, 512KX8, 120ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp TC5563APL-10 vs WS128K32-120HSM
CY7C199B-25SC Standard SRAM, 32KX8, 25ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOIC-28 Cypress Semiconductor TC5563APL-10 vs CY7C199B-25SC
CY7C196-25LC Standard SRAM, 64KX4, 25ns, CMOS, LCC-28 Cypress Semiconductor TC5563APL-10 vs CY7C196-25LC
KM681000ALR-7L Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, REVERSE, TSOP-32 Samsung Semiconductor TC5563APL-10 vs KM681000ALR-7L
WS512K32L-20G2LQ SRAM Module, 512KX32, 20ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp TC5563APL-10 vs WS512K32L-20G2LQ

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