Datasheets
CXK5864BSP-10L by: Sony Semiconductor

Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, MO-058AB, DIP-28

Part Details for CXK5864BSP-10L by Sony Semiconductor

Overview of CXK5864BSP-10L by Sony Semiconductor

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Applications Consumer Electronics Computing and Data Storage

Part Details for CXK5864BSP-10L

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CXK5864BSP-10L Part Data Attributes:

CXK5864BSP-10L Sony Semiconductor
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CXK5864BSP-10L Sony Semiconductor Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, MO-058AB, DIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SONY CORP
Part Package Code DIP
Package Description 0.300 INCH, PLASTIC, MO-058AB, DIP-28
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 100 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T28
JESD-609 Code e0
Length 35.1 mm
Memory Density 65536 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 28
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 8KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.4 mm
Standby Current-Max 0.000035 A
Standby Voltage-Min 2 V
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for CXK5864BSP-10L

This table gives cross-reference parts and alternative options found for CXK5864BSP-10L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CXK5864BSP-10L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HY6264ALLP-100 Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 SK Hynix Inc CXK5864BSP-10L vs HY6264ALLP-100
TC5565APL-10L IC 8K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM Toshiba America Electronic Components CXK5864BSP-10L vs TC5565APL-10L
HM6264LP-10L 8KX8 STANDARD SRAM, 100ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Renesas Electronics Corporation CXK5864BSP-10L vs HM6264LP-10L
HM6264P-10 8KX8 STANDARD SRAM, 100ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Renesas Electronics Corporation CXK5864BSP-10L vs HM6264P-10
U6264ADC10LL Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 ZMDI CXK5864BSP-10L vs U6264ADC10LL
MSM5165AL-10RS Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 OKI Electric Industry Co Ltd CXK5864BSP-10L vs MSM5165AL-10RS
TC5565APL-10 IC 8K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM Toshiba America Electronic Components CXK5864BSP-10L vs TC5565APL-10
KM6264B-10 Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Samsung Semiconductor CXK5864BSP-10L vs KM6264B-10
U6264ADG10LL Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 ZMDI CXK5864BSP-10L vs U6264ADG10LL
KM6264BLP-10L Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, DIP-28 Samsung Semiconductor CXK5864BSP-10L vs KM6264BLP-10L
Part Number Description Manufacturer Compare
5962-9318704HUA SRAM Module, 512KX8, 70ns, CMOS, CHIP66, White Microelectronics CXK5864BSP-10L vs 5962-9318704HUA
JM38510/29315BYC Standard SRAM, 64KX4, 35ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Micross Components CXK5864BSP-10L vs JM38510/29315BYC
5962-9318707HUX Cache SRAM Module, 128KX32, 35ns, CMOS, HIP-66 White Microelectronics CXK5864BSP-10L vs 5962-9318707HUX
CY7C199C-12VI Standard SRAM, 32KX8, 12ns, CMOS, PDSO28, 0.300 INCH, MO-088, SOJ-28 Rochester Electronics LLC CXK5864BSP-10L vs CY7C199C-12VI
CY7C199CN-15ZXC Standard SRAM, 32KX8, 15ns, CMOS, PDSO28, LEAD FREE, PLASTIC, TSOP-28 Cypress Semiconductor CXK5864BSP-10L vs CY7C199CN-15ZXC
5962-9318702HXC SRAM Module, 512KX8, 100ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation CXK5864BSP-10L vs 5962-9318702HXC
5962-3829429MZX Standard SRAM, 8KX8, 25ns, CMOS, CDIP28, CERAMIC, DIP-28 LOGIC Devices Inc CXK5864BSP-10L vs 5962-3829429MZX
JM38510/29314BNC Standard SRAM, 64KX4, 45ns, CMOS, CQCC28, CERAMIC, LCC-28 Micross Components CXK5864BSP-10L vs JM38510/29314BNC
5962-9318708HUC Cache SRAM Module, 128KX32, 25ns, CMOS, HIP-66 Cobham Power Products CXK5864BSP-10L vs 5962-9318708HUC
5962-9318705HUX SRAM Module, 512KX8, 55ns, CMOS, CHIP66, White Microelectronics CXK5864BSP-10L vs 5962-9318705HUX

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