Datasheets
MPC603RRX300LC by:

32-BIT, 300MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255

Part Details for MPC603RRX300LC by Motorola Mobility LLC

Overview of MPC603RRX300LC by Motorola Mobility LLC

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Applications Industrial Automation Renewable Energy Robotics and Drones

Part Details for MPC603RRX300LC

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MPC603RRX300LC Part Data Attributes

MPC603RRX300LC Motorola Mobility LLC
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MPC603RRX300LC Motorola Mobility LLC 32-BIT, 300MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255
Part Life Cycle Code Transferred
Ihs Manufacturer MOTOROLA INC
Part Package Code BGA
Package Description BGA,
Pin Count 255
Reach Compliance Code unknown
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan NO
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B255
Length 21 mm
Low Power Mode YES
Number of Terminals 255
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 3 mm
Speed 300 MHz
Supply Voltage-Nom 2.5 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for MPC603RRX300LC

This table gives cross-reference parts and alternative options found for MPC603RRX300LC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC603RRX300LC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MPC603RRX300LC 32-BIT, 300MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 Freescale Semiconductor MPC603RRX300LC vs MPC603RRX300LC
Part Number Description Manufacturer Compare
TSPC740AVGB/Q10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, CERAMIC, BGA-255 Thales Group MPC603RRX300LC vs TSPC740AVGB/Q10LE
TSPC740AVGU/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation MPC603RRX300LC vs TSPC740AVGU/T10LH
TSXPC740AVGS12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 Atmel Corporation MPC603RRX300LC vs TSXPC740AVGS12LE
WED3C755E8M-350BC RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 White Electronic Designs Corp MPC603RRX300LC vs WED3C755E8M-350BC
TSPC740AMGSU8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 Atmel Corporation MPC603RRX300LC vs TSPC740AMGSU8LE
TSPC740AMG8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 Thales Group MPC603RRX300LC vs TSPC740AMG8LH
TSXPC603EMGB/T3MN RISC Microprocessor, 32-Bit, 100MHz, CMOS, CBGA255, CERAMIC, BGA-255 e2v technologies MPC603RRX300LC vs TSXPC603EMGB/T3MN
TS(X)PC603EVGB/T5LN RISC Microprocessor, 32-Bit, 133MHz, CMOS, CBGA255, CERAMIC, BGA-255 Thales Group MPC603RRX300LC vs TS(X)PC603EVGB/T5LN
TSPC603RMGU6LC RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 e2v technologies MPC603RRX300LC vs TSPC603RMGU6LC
TS(X)PC603EVGB/C4LN RISC Microprocessor, 32-Bit, 120MHz, CMOS, CBGA255, CERAMIC, BGA-255 Thales Group MPC603RRX300LC vs TS(X)PC603EVGB/C4LN

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