Datasheets
TSPC740AMG8LH by:

RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255

Part Details for TSPC740AMG8LH by Thales Group

Overview of TSPC740AMG8LH by Thales Group

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Part Details for TSPC740AMG8LH

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TSPC740AMG8LH Part Data Attributes:

TSPC740AMG8LH Thales Group
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TSPC740AMG8LH Thales Group RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255
Part Life Cycle Code Obsolete
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS
Part Package Code BGA
Package Description ,
Pin Count 255
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 83.3 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B255
Low Power Mode YES
Number of Terminals 255
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Speed 200 MHz
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.5 V
Supply Voltage-Nom 2.6 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form BALL
Terminal Position BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for TSPC740AMG8LH

This table gives cross-reference parts and alternative options found for TSPC740AMG8LH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC740AMG8LH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TSXPC740AVG8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies TSPC740AMG8LH vs TSXPC740AVG8LE
TSXPC740AMGB/T8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies TSPC740AMG8LH vs TSXPC740AMGB/T8LE
TSXPC740AMGB/T8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC740AMG8LH vs TSXPC740AMGB/T8LH
TSPC740AMGU/T8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC740AMG8LH vs TSPC740AMGU/T8LH
TSPC740AMG8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies TSPC740AMG8LH vs TSPC740AMG8LE
TSPC740AVGB/T8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 Thales Group TSPC740AMG8LH vs TSPC740AVGB/T8LH
TSXPC740AMG8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies TSPC740AMG8LH vs TSXPC740AMG8LE
TSPC740AVGU/T8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC740AMG8LH vs TSPC740AVGU/T8LH
TSXPC740AMGB/Q8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies TSPC740AMG8LH vs TSXPC740AMGB/Q8LE
TSXPC740AMGU/T8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC740AMG8LH vs TSXPC740AMGU/T8LE
Part Number Description Manufacturer Compare
TS(X)PC603EMGU3LN 32-BIT, 100MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 e2v technologies TSPC740AMG8LH vs TS(X)PC603EMGU3LN
IBM25EMPPC740LFBB3330 RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 IBM TSPC740AMG8LH vs IBM25EMPPC740LFBB3330
TSXPC740AVG10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies TSPC740AMG8LH vs TSXPC740AVG10LE
TSXPC603EVGU/T2LL RISC Microprocessor, 32-Bit, 80MHz, CMOS, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC740AMG8LH vs TSXPC603EVGU/T2LL
TSXPC740AVGS12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 Atmel Corporation TSPC740AMG8LH vs TSXPC740AVGS12LE
TSPC740AVGU/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC740AMG8LH vs TSPC740AVGU/T10LH
WED3C755E8M-350BC RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 White Electronic Designs Corp TSPC740AMG8LH vs WED3C755E8M-350BC
PPC604EBX166X RISC Microprocessor, 32-Bit, 166.67MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 IBM TSPC740AMG8LH vs PPC604EBX166X
TS(X)PC603RMGSB/Q6L(C) RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255 Thales Group TSPC740AMG8LH vs TS(X)PC603RMGSB/Q6L(C)
TSXPC603RVG12LC RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 e2v technologies TSPC740AMG8LH vs TSXPC603RVG12LC

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