Part Details for TSXPC603EMGB/T3MN by e2v technologies
Overview of TSXPC603EMGB/T3MN by e2v technologies
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for TSXPC603EMGB/T3MN
TSXPC603EMGB/T3MN CAD Models
TSXPC603EMGB/T3MN Part Data Attributes:
|
TSXPC603EMGB/T3MN
e2v technologies
Buy Now
Datasheet
|
Compare Parts:
TSXPC603EMGB/T3MN
e2v technologies
RISC Microprocessor, 32-Bit, 100MHz, CMOS, CBGA255, CERAMIC, BGA-255
|
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ATMEL GRENOBLE | |
Part Package Code | BGA | |
Package Description | , | |
Pin Count | 255 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 66.67 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B255 | |
Low Power Mode | YES | |
Number of Terminals | 255 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Screening Level | MIL-STD-883 | |
Speed | 100 MHz | |
Supply Voltage-Max | 3.465 V | |
Supply Voltage-Min | 3.135 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSXPC603EMGB/T3MN
This table gives cross-reference parts and alternative options found for TSXPC603EMGB/T3MN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXPC603EMGB/T3MN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
TS(X)PC603EMGU3LN | 32-BIT, 100MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 | e2v technologies | TSXPC603EMGB/T3MN vs TS(X)PC603EMGU3LN |
IBM25EMPPC740LFBB3330 | RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | IBM | TSXPC603EMGB/T3MN vs IBM25EMPPC740LFBB3330 |
TSXPC740AVG10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | e2v technologies | TSXPC603EMGB/T3MN vs TSXPC740AVG10LE |
TSXPC603EVGU/T2LL | RISC Microprocessor, 32-Bit, 80MHz, CMOS, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSXPC603EMGB/T3MN vs TSXPC603EVGU/T2LL |
TSXPC740AVGS12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 | Atmel Corporation | TSXPC603EMGB/T3MN vs TSXPC740AVGS12LE |
TSPC740AVGU/T10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSXPC603EMGB/T3MN vs TSPC740AVGU/T10LH |
WED3C755E8M-350BC | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | White Electronic Designs Corp | TSXPC603EMGB/T3MN vs WED3C755E8M-350BC |
PPC604EBX166X | RISC Microprocessor, 32-Bit, 166.67MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | IBM | TSXPC603EMGB/T3MN vs PPC604EBX166X |
TS(X)PC603RMGSB/Q6L(C) | RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255 | Thales Group | TSXPC603EMGB/T3MN vs TS(X)PC603RMGSB/Q6L(C) |
TSXPC603RVG12LC | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | e2v technologies | TSXPC603EMGB/T3MN vs TSXPC603RVG12LC |