MPC603RRX300LC
vs
WED3C755E8M-350BC
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
WHITE ELECTRONIC DESIGNS CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
BGA,
|
21 X 25 MM, 3.90 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
|
| Pin Count |
255
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
YES
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-CBGA-B255
|
R-CBGA-B255
|
| Length |
21 mm
|
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
255
|
255
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3 mm
|
3.85 mm
|
| Speed |
300 MHz
|
350 MHz
|
| Supply Voltage-Nom |
2.5 V
|
2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
21 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| ECCN Code |
|
3A991.A.2
|
| Clock Frequency-Max |
|
66 MHz
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Equivalence Code |
|
BGA255,16X16,50
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Supply Voltage-Max |
|
2.1 V
|
| Supply Voltage-Min |
|
1.9 V
|
| Temperature Grade |
|
COMMERCIAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MPC603RRX300LC with alternatives
Compare WED3C755E8M-350BC with alternatives