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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: MPC603RRX300LC under Microprocessors

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Select Parts		Part Number

		MPC603RRX300LC Motorola Semiconductor Products
		MPC603RRX300LC Freescale Semiconductor
		MPC603RRX300LC Motorola Mobility LLC

				Most Relevant						Technical						Compliance			Operating Conditions			Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Part Package Code	Pin Count	ECCN Code	Samacsys Manufacturer

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Transferred

32

300 MHz

64

32

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

NO

FLOATING POINT

YES

YES

S-CBGA-B255

Not Qualified

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3 mm

21 mm

21 mm

MOTOROLA INC

CERAMIC, BGA-255

unknown

8542.31.00.01

Check for Price

No

No

Obsolete

32

300 MHz

64

32

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

NO

FLOATING POINT

YES

YES

S-CBGA-B255

Not Qualified

e0

1

245

30

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3 mm

21 mm

21 mm

FREESCALE SEMICONDUCTOR INC

CERAMIC, BGA-255

not_compliant

8542.31.00.01

BGA

255

3A991.A.2

NXP

Check for Price

Transferred

32

300 MHz

64

32

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

NO

FLOATING POINT

YES

YES

S-CBGA-B255

Not Qualified

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3 mm

21 mm

21 mm

MOTOROLA INC

BGA,

unknown

8542.31.00.01

BGA

255

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Motorola Semiconductor Products

Check for Price

Transferred

32

300 MHz

64

32

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

NO

FLOATING POINT

YES

YES

S-CBGA-B255

Not Qualified

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3 mm

21 mm

21 mm

MOTOROLA INC

CERAMIC, BGA-255

unknown

8542.31.00.01

Microcontrollers and Processors

Freescale Semiconductor

Check for Price

No

No

Obsolete

32

300 MHz

64

32

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

NO

FLOATING POINT

YES

YES

S-CBGA-B255

Not Qualified

e0

1

245

30

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3 mm

21 mm

21 mm

FREESCALE SEMICONDUCTOR INC

CERAMIC, BGA-255

not_compliant

8542.31.00.01

BGA

255

3A991.A.2

NXP

Microcontrollers and Processors

Motorola Mobility LLC

Check for Price

Transferred

32

300 MHz

64

32

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

NO

FLOATING POINT

YES

YES

S-CBGA-B255

Not Qualified

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3 mm

21 mm

21 mm

MOTOROLA INC

BGA,

unknown

8542.31.00.01

BGA

255