Part Details for TSPC740AMGSU8LE by Atmel Corporation
Overview of TSPC740AMGSU8LE by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSPC740AMGSU8LE
TSPC740AMGSU8LE CAD Models
TSPC740AMGSU8LE Part Data Attributes:
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TSPC740AMGSU8LE
Atmel Corporation
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Datasheet
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TSPC740AMGSU8LE
Atmel Corporation
RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ATMEL CORP | |
| Part Package Code | CGA | |
| Package Description | CGA, | |
| Pin Count | 255 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 83.3 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-X255 | |
| Length | 21 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 255 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | CGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Speed | 200 MHz | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.5 V | |
| Supply Voltage-Nom | 2.6 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | UNSPECIFIED | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSPC740AMGSU8LE
This table gives cross-reference parts and alternative options found for TSPC740AMGSU8LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC740AMGSU8LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSPC740AVGSU8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 | Atmel Corporation | TSPC740AMGSU8LE vs TSPC740AVGSU8LH |
| TSPC740AVGSB/Q8LH | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSPC740AMGSU8LE vs TSPC740AVGSB/Q8LH |
| TSPC740AVGSU/T8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSPC740AMGSU8LE vs TSPC740AVGSU/T8LE |
| TSXPC740AMGSB/T8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 | Atmel Corporation | TSPC740AMGSU8LE vs TSXPC740AMGSB/T8LE |
| TSPC740AMGS8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | e2v technologies | TSPC740AMGSU8LE vs TSPC740AMGS8LE |
| TSXPC740AVGSU8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 | Atmel Corporation | TSPC740AMGSU8LE vs TSXPC740AVGSU8LE |
| TSPC740AMGSB/T8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 | Atmel Corporation | TSPC740AMGSU8LE vs TSPC740AMGSB/T8LE |
| TSXPC740AMGSB/Q8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | e2v technologies | TSPC740AMGSU8LE vs TSXPC740AMGSB/Q8LE |
| TSPC740AMGSU/T8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, CERAMIC, BGA-255 | Thales Group | TSPC740AMGSU8LE vs TSPC740AMGSU/T8LE |
| TSPC740AMGSU/T8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | e2v technologies | TSPC740AMGSU8LE vs TSPC740AMGSU/T8LE |